Donor plate, deposition device and deposition method

A deposition device, comprising:

• a donor plate for deposition of a deposition substance on a target, the donor plate comprising multiple layers, in a layered order, of:
• a flexible substrate having a first main surface;
• an electrode layer;
• a first electrically insulating layer;
• a resistive heater layer;
• a second electrically insulating layer;
• and
• a patterned layer provided with one or more recesses for holding deposition substance to be deposited on the target,
• wherein the electrode layer comprises a first electrode and a second electrode of a complementary shape and being electrically insulated from each other, and
• wherein the resistive heater layer is electrically connected to each of a contact surface of the first electrode and a contact surface of the second electrode via at least one respective slit in the first electrically insulating layer;
• and
• a plate carrier,
• wherein the donor plate is laterally attached at a second main surface, opposite the first main surface, to a first plate carrier surface of the plate carrier.

A method of depositing using a donor plate, wherein the donor plate comprises multiple layers, in a layered order, of:

• a flexible substrate having a first main surface;
• an electrode layer;
• a first electrically insulating layer;
• a resistive heater layer;
• a second electrically insulating layer;
• and
• a patterned layer provided with one or more recesses for holding deposition substance to be deposited on the target,
• wherein the electrode layer comprises a first electrode and a second electrode of a complementary shape and being electrically insulated from each other, and
• wherein the resistive heater layer is electrically connected to each of a contact surface of the first electrode and a contact surface of the second electrode via at least one respective slit in the first electrically insulating layer, and
• wherein the method comprises:
• positioning the donor plate with its patterned layer in a non-contacting manner in front of the target;
• substantially uniformly heating the donor plate with the resistive heater layer to therewith deform the donor plate to cause the patterned layer to move towards the target;
• ejecting the deposition substance to be deposited from the recesses onto the target;
• and
• cooling down the donor plate to remove the patterned layer from the target.