Printed circuit board assembly, heating control circuit and control method thereof
AssigneeGetac Technology Corporation
InventorsLi-Shing CHEN, Ying-Wei LEE
Life of this patent
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AssigneeGetac Technology Corporation
InventorsLi-Shing CHEN, Ying-Wei LEE
Estimating the term…
A printed circuit board assembly includes a circuit board, a heating resistor and a switch. The circuit board includes a component layer, a signal layer, a conductive layer and a conductive via. The component layer includes a mounted area for mounting a component. The signal layer includes first and second signal traces. The conductive layer is disposed between the component layer and the signal layer. The component layer includes a conductive pattern. The conductive via connects the first signal trace to the conductive pattern. The heating resistor includes a first terminal electrically connected to the first signal trace and a second terminal electrically connected to the second signal trace. The conductive pattern, the conductive via, the first signal trace, the heating resistor, the switch and the second signal trace are electrically connected in series between a power supply voltage terminal and a ground terminal.
A printed circuit board assembly, comprising:
A heating control circuit, comprising:
A control method for a heating control circuit, the heating control circuit comprising a heater resistor and a switch electrically connected in series between a power voltage terminal and a ground terminal, an overtemperature protection circuit electrically connected between the heater resistor and a control terminal of the switch, and a controller electrically connected to the control terminal of the switch, the control method comprising:
Dependencies are inferred from the claim text.