US 2026/0136453 A1 · COLD-BAR SOLDERING SYSTEMS AND METHODS

Abstract

A flexible circuit board (FCB) can include one or more pads disposed on a first side of the FCB and a heating element having connections for coupling to an external power supply disposed on a second side of the FCB. A printed circuit board (PCB) can include one or more lands disposed on a surface of the PCB. Solder is disposed on each of the one or more lands. The one or more FCB pads are placed into contact with respective ones of the one or more PCB lands. A pressure application subsystem maintains even pressure on the portion of the FCB occupied by the one or more pads while the external power supply supplies power to the heating element. The thermal energy produced by the heating element causes the solder between the FCB pads and the PCB lands to reflow, physically and conductively coupling the FCB to the PCB.

Claims17

Dependent claims

A flexible circuit board (FCB) comprising:

a flexible dielectric layer having a first surface having a first area, a thickness, and a second surface transversely opposed across the thickness of the dielectric layer to the first surface;
one or more pads disposed on the first surface of the flexible dielectric layer;
and
a heating element that includes one or more electrical traces disposed on the second surface of the dielectric layer proximate the area occupied by the one or more pads disposed on the first surface of the flexible dielectric layer
wherein the heating element includes at least two exposed terminals to receive a voltage when coupled to a removable power supply;
and
wherein the heating element produces a thermal energy output of from about 0.5 W/mm2 to about 2.0 W/mm2 in the portion of the dielectric layer proximate the one or more pads when coupled to the removable power supply.

4 more elements

A method to conductively couple one or more pads disposed on a first surface of a flexible circuit board (FCB) to respective ones of one or more lands disposed on a surface of a printed circuit board (PCB), the method comprising:

causing, by control circuitry, an electrical connection between a variable output power supply and a heating element disposed on a second surface of the FCB transversely opposed across a thickness of the FCB to the first surface of the FCB;
wherein each of the one or more pads on the first surface of the FCB are disposed proximate solder deposited on corresponding ones of the one or more lands on the surface of the PCB;
and
wherein the heating element includes one or more electrical traces disposed on the second surface of the FCB proximate the area occupied by the one or more pads disposed on the first surface of the FCB;
retrieving, by the control circuitry from memory circuitry, data representative of one or more electrical parameter profiles;
and
causing a reflow of the solder between each of the one or more pads disposed on the surface of the FCB and corresponding ones of the one or more lands disposed on a surface of the PCB by:
controlling, by the control circuitry, the power supply output to the heating element such that the power supply output corresponds to the retrieved one or more electrical parameter profiles;
wherein the one or more electrical parameter profiles cause the heating element disposed on the second surface of the FCB to produce heat sufficient to cause reflow of the solder between the one or more FCB pads and corresponding ones of the PCB lands;
and
causing, by the control circuitry, an external pressure application subsystem to apply pressure to the FCB and the PCB in at least the portion of the FCB occupied by the heating element.

8 more elements

Dependencies are inferred from the claim text.

Cold-bar soldering systems and methods

Life of this patent

Cold-bar soldering systems and methods

Life of this patent

Abstract

Claims17