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US 12,457,680 B2Granted
Circuit board cooling configurations
AssigneeMicrosoft Technology Licensing, LLC
InventorRuslan Nagimov
Life of this patent
Estimating the term…
Abstract
The discussion relates to thermal management. One example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. In this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.
Claims20
A system, comprising:
- a circuit board comprising a substrate having a thickness defined between two major surfaces and including inner intermediate and outer generally concentric zones;
- a cryogenically cooled chip located in the inner zone;
- non-cryogenic electronic components positioned in the outer zone;
- and,
- the intermediate zone defining voids extending through the thickness interposed between bridges extending from the inner zone to the outer zone to create a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.
2 more elements
A device, comprising:
- a circuit board extending along a plane and including an inner zone an intermediate zone and an outer zone concentrically arranged around an axis that is perpendicular to the plane;
- a cold chip located in the inner zone that has an operating temperature below standard temperature;
- an electronic component positioned in the outer zone that has an operating temperature above standard temperature;
- and,
- the intermediate zone having a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone to prevent the electronic component of the outer zone from being cooled below the standard temperature.
2 more elements
A device, comprising:
- a circuit board defining a major surface and including an inner zone an intermediate zone and an outer zone arranged along the major surface;
- a cold chip located in the inner zone and cooled by a cooling system;
- and,
- the intermediate zone having a skeletonized configuration at the major surface that is configured to slow thermal energy movement from the outer zone to the inner zone.
1 more element
Dependencies are inferred from the claim text.