Shaping method and shaping device

A shaping device comprising:

• an ejection device;
• a planarization device;
• a curing device;
• a heater;
• and
• a control device including a processor configured to
• cause the ejection device to eject a first curable viscous fluid, cause the planarization device to planarize the ejected first curable viscous fluid, and cause the curing device to cure the planarized ejected first curable viscous fluid to form a cured layer having a surface with an unevenness formed thereon,
• determine a size of the unevenness formed on the cured layer,
• cause the ejection device to eject a second curable viscous fluid onto the surface of the cured layer, an injection amount of the second curable viscous fluid corresponding to the determined size of the unevenness formed on the surface of the cured layer,
• cause the heater to heat the ejected second curable viscous fluid ejected by the second ejection section,
• cause the curing device to cure the second curable viscous fluid heated by the heater and ejected by the second ejection section to form a smooth surface on the surface of the cured layer without planarizing the second curable viscous fluid by the planarization device,
• cause the ejection device to eject a fluid containing metal particles onto the smooth surface,
• cause the curing device to cure the fluid containing the ejected metal particles,
• determine whether a metal wiring has been formed on the smooth surface having at least one of a predetermined thickness, shape, or electrical characteristic, and
• when it determined that the metal wiring has not been formed, cause the ejection device to eject the fluid containing metal particles and cause the curing device to cure the fluid containing the ejected metal particles.