H05K 2203/1126
Firing, i.e. heating a powder or paste above the melting temperature of
Official title: Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
H05K2203/1126 (Firing, i.e. heating a powder or paste above the melting temperature of) appears on 112 US grants and 135 published applications in this corpus.
Search patents in H05K- Granted patents
- 112
- Published applications
- 135
- Assignees
- 75
- Inventors
- 344
- Latest grant
- 30 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 3 |
| 2006 | 1 | 5 |
| 2007 | 1 | 4 |
| 2008 | 2 | 10 |
| 2009 | 0 | 12 |
| 2010 | 7 | 11 |
| 2011 | 5 | 8 |
| 2012 | 4 | 4 |
| 2013 | 4 | 5 |
| 2014 | 7 | 9 |
| 2015 | 7 | 10 |
| 2016 | 5 | 6 |
| 2017 | 7 | 6 |
| 2018 | 6 | 9 |
| 2019 | 8 | 7 |
| 2020 | 5 | 4 |
| 2021 | 3 | 6 |
| 2022 | 6 | 5 |
| 2023 | 1 | 4 |
| 2024 | 4 | 1 |
| 2025 | 4 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Module and method for manufacturing same30 Sep 2025US 12,432,858 B2Murata Manufacturing Co., Ltd.
- Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body1 Jul 2025US 12,343,820 B2Kabushiki Kaisha Toshiba
- Circuit module and RFID tag17 Jun 2025US 12,333,369 B2Murata Manufacturing Co., Ltd.
- Silicon nitride sintered body, silicon nitride substrate, and silicon nitride circuit board7 Jan 2025US 12,187,651 B2Kabushiki Kaisha Toshiba
- Method for manufacturing shielded printed wiring board and shielded printed wiring board19 Nov 2024US 12,150,239 B2Tatsuta Electric Wire & Cable Co., Ltd.
- Manufacturing of electric circuits on insulating coatings22 Jan 2026US 2026/0025929 A1Oerlikon Am Europe GmbH
- Ceramic substrate and method for manufacturing ceramic substrate3 Jul 2025US 2025/0214324 A1Murata Manufacturing Co., Ltd.
- Wiring board5 Jun 2025US 2025/0185162 A1KYOCERA Corporation
- Wiring board1 May 2025US 2025/0142724 A1KYOCERA Corporation
- Method for Manufacturing Shielded Printed Wiring Board and Shielded Printed Wiring Board23 Jan 2025US 2025/0031298 A1Tatsuta Electric Wire & Cable Co., Ltd.
Most cited
By later US patents
- Method for making a ceramic multilayer structure having internal copper conductors56US 4,766,027 AE. I. Du Pont de Nemours and Company · 1988
- Method for producing a multilayer ceramic circuit board41US 4,642,148 AFujitsu Limited · 1987
- Infrared furnace with atmosphere control capability36US 4,517,448 ARadiant Technology Corporation · 1985
- Process of manufacturing ceramic circuit board35US 4,551,357 ANGK Insulators, Ltd. · 1985
- Glass-ceramic structure and method for making same33US 5,029,242 AInternational Business Machines Corporation · 1991