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US 2025/0142724 A1Published application
Wiring board
AssigneeKYOCERA Corporation
InventorsToshifumi HIGASHI, Hiroaki SANO, Akira IMOTO, Takafumi YAMAGUCHI, Sentarou YAMAMOTO
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Abstract
A wiring board includes an insulation layer made of ceramic, and a via conductor extending through the insulation layer in a thickness direction. The via conductor includes a metal portion and a ceramic portion. The metal portion includes a continuous phase disposed along the thickness direction of the insulation layer in a vertical cross-sectional view.
Claims17
A wiring board comprising:
- an insulation layer made of ceramic;
- and
- a via conductor extending through the insulation layer in a thickness direction, wherein
- the via conductor comprises a metal portion and a ceramic portion, and
- the metal portion comprises a continuous phase disposed along the thickness direction of the insulation layer in a vertical cross-sectional view.
2 more elements
Dependencies are inferred from the claim text.