Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body

A brazing material for bonding a ceramic substrate and a copper plate,

• wherein when a total of raw elements is taken as 100 mass %, the brazing material comprises:
• more than 0 mass % and not more than 75 mass % of Ag;
• not less than 15 mass % and not more than 85 mass % of Cu;
• not less than 1 mass % and not more than 15 mass % of one or two of Ti or TiH2;
• not less than 1 mass % and not more than 50 mass % of either Sn or In;
• and
• not less than 0 mass % and not more than 2 mass % of C,
• a mass ratio of Ag to Cu being not more than 1.3,
• a mass ratio of Sn to Ag or a mass ratio of In to Ag being not less than 0.25,
• wherein
• an average grain size D50 of Ag is less than an average grain size D50 of Cu, and
• the average grain size D50 of Ag is less than an average grain size D50 of Sn or In,
• wherein when using a differential scanning calorimeter (DSC) a DSC curve is measured, the brazing material has an endothermic peak within a range of not less than 550° C. and not more than 700° C. in a heating process and one or both of an endothermic peak or an exothermic peak within a range of not less than 140° C. and not more than 300° C. in the heating process.