H05K 2203/1157
Using means for chemical reduction
H05K2203/1157 (Using means for chemical reduction) appears on 179 US grants and 184 published applications in this corpus.
Search patents in H05K- Granted patents
- 179
- Published applications
- 184
- Assignees
- 145
- Inventors
- 556
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 11 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 9 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 2 |
| 2002 | 0 | 2 |
| 2003 | 6 | 2 |
| 2004 | 2 | 6 |
| 2005 | 3 | 10 |
| 2006 | 1 | 13 |
| 2007 | 3 | 7 |
| 2008 | 4 | 10 |
| 2009 | 3 | 18 |
| 2010 | 2 | 13 |
| 2011 | 6 | 6 |
| 2012 | 3 | 8 |
| 2013 | 8 | 6 |
| 2014 | 9 | 15 |
| 2015 | 1 | 11 |
| 2016 | 4 | 16 |
| 2017 | 11 | 9 |
| 2018 | 8 | 4 |
| 2019 | 8 | 11 |
| 2020 | 4 | 5 |
| 2021 | 3 | 4 |
| 2022 | 4 | 1 |
| 2023 | 5 | 1 |
| 2024 | 0 | 2 |
| 2025 | 1 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Conductive traces5 May 2026US 12,621,936 B2Peridot Print LLC
- Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks2 Sep 2025US 12,407,349 B2EKC Technology, Inc.
- Process and device for low-temperature pressure sintering3 Oct 2023US 11,776,932 B2Danfoss Silicon Power GmbH
- Method for manufacturing circuit board including metal-containing layer26 Sep 2023US 11,770,903 B2Korea Institute of Science and Technology
- Flux, solder paste and method for producing soldered product29 Aug 2023US 11,738,415 B2Senju Metal Industry Co., Ltd.
- Method for removing an organic resin from a surface of a substrate13 Aug 2026US 2026/0239539 A1Atotech Deutschland GmbH
- Method for manufacturing an electrically conductive metal trace and corresponding metal trace, particularly suitable for transient electronic devices11 Sep 2025US 2025/0282971 A1Ecole Polytechnique Federale De Lausanne (Epfl)
- Systems and methods for additive manufacturing of electronics16 May 2024US 2024/0164016 A1
- Conductive traces4 Jan 2024US 2024/0008187 A1Hewlett-Packard Development Company, L. P.
- Flux, solder paste and method for producing soldered product6 Apr 2023US 2023/0107101 A1Senju Metal Industry Co., Ltd.
Most cited
By later US patents
- Method of bonding copper and resin81US 4,642,161 AHitachi, Ltd. · 1987
- Method of fabricating an electronic circuit device77US 5,865,365 AHitachi, Ltd. · 1999
- Process for treating copper surface74US 4,902,551 AHitachi Chemical Company, Ltd. · 1990
- Process for producing copper clad laminate72US 5,382,333 AMitsubishi Gas Chemical Company, Inc. · 1995
- Process for the production of a printing plate by inkjet67US 5,501,150 AAgfa-Gevaert · 1996