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US 4,902,551 AGranted
Process for treating copper surface
AssigneeHitachi Chemical Company, Ltd.
InventorsAkishi Nakaso, Toshiro Okamura, Haruo Ogino, Tomoko Watanabe, Yuko Kimura
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Abstract
Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.
Claims14
A process for treating a copper surface which comprises
- forming a copper oxide layer on a copper surface by treating with an aqueous solution containing an oxidizing agent, and
- treating the copper oxide layer with an aqueous aldehyde solution having a pH of 9.0 or higher to reduce the copper oxide,
- said treatment of the copper oxide layer being carried out
- (a) while applying a potential of -1000 mV to -400 mV in terms of Ag-AgCl electrode to the copper oxide layer, or
- (b) after contacting the copper oxide layer with a contacting piece made of copper or a metal nobler than copper, or
- (c) after contacting the copper oxide layer with an aqueous solution containing an alkali borohydride so as to make the potential of copper in the range of -1000 mV to -400 mV in terms of Ag-AgCl electrode.
3 more elements
Dependencies are inferred from the claim text.