Process and device for low-temperature pressure sintering

A process for producing an electronic subassembly by low-temperature pressure sintering, comprising:

• arranging an electronic component on a circuit carrier having a conductor track;
• connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, thereby producing the electronic subassembly;
• sparging or evaporation-coating the electronic subassembly with a reducing agent;
• and
• cooling the electronic subassembly from a sintering temperature reached due to the low-temperature pressure sintering;
• wherein the low-temperature pressure sintering is carried out in a closable sintering chamber comprising a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%;
• and
• wherein the sparging or evaporation-coating is carried out after the connecting of the electronic component to the circuit carrier by the low-temperature pressure sintering and before the cooling.

A process for producing an electronic subassembly by low-temperature pressure sintering in a sintering chamber having a pressure pad, comprising the following steps:

• arranging an electronic component on a circuit carrier having a conductor track,
• connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier,
• wherein to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a closable sintering chamber comprising a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%,
• wherein after the sintering chamber is closed, and the low oxygen atmosphere is initially established, a period of time elapses between when the low oxygen atmosphere is initially established and before the sintering is initiated, and
• wherein the connecting the electronic component to the circuit carrier by low-temperature pressure sintering includes pressing the electronic component, the circuit carrier and the pressure pad together such that the pressure pad provides quasi-hydrostatic pressure distribution to the electronic component.