Process for producing copper clad laminate
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsKazuhiro Ando, Takamasa Kawakami, Yasuhiro Shouji, Yasuo Tanaka, Takeo Kanaoka, Norio Sayama
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Abstract
A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.
Claims1
A process for producing a copper-clad laminate which comprises placing a (i) copper foil on (ii) prepregs to form an assembly and lamination molding the resulting assembly, wherein the (i) copper foil is an electrodeposited copper foil or a rolled copper foil and is obtained by treating a surface of a (iii) starting copper foil with an oxidizing aqueous alkaline solution to thereby form, on the surface of the (iii) starting copper foil, a fine roughness constituted of a copper oxide of a brown to black color and then reducing the copper oxide which constitutes the fine roughness in an atmosphere in which hydrazine as a reducing gas is present, to thereby form a roughened surface for adhesion while the fine roughness is maintained substantially unchanged, wherein said reducing is conducted at a temperature of from 60.degree. to 160.degree. C. under a hydrazine gas pressure of from 0.1 to 15 mmHg.
Dependencies are inferred from the claim text.