Method for manufacturing circuit board including metal-containing layer

A method for manufacturing a circuit board, the method comprising:

• (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator;
• (b) immersing a dielectric substrate in the mixture;
• (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere;
• (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating;
• and
• (e) forming a metal pattern on the dielectric substrate, wherein
• the first metal layer comprises Cu, Ni, Co, Au, Pd, or an alloy thereof,
• the second metal layer comprises Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof,
• the anti-sintering agent comprises TixOy wherein X>y, TiN, TIC, or a combination thereof, and
• the method further comprises performing heat treatment at least once after step (c).