H05K 2203/1173
Differences in wettability
Official title: Differences in wettability, e.g. hydrophilic or hydrophobic areas
H05K2203/1173 (Differences in wettability) appears on 177 US grants and 251 published applications in this corpus.
Search patents in H05K- Granted patents
- 177
- Published applications
- 251
- Assignees
- 135
- Inventors
- 516
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 3 |
| 2003 | 1 | 8 |
| 2004 | 8 | 8 |
| 2005 | 4 | 18 |
| 2006 | 4 | 21 |
| 2007 | 6 | 24 |
| 2008 | 5 | 12 |
| 2009 | 9 | 17 |
| 2010 | 14 | 15 |
| 2011 | 9 | 11 |
| 2012 | 15 | 7 |
| 2013 | 6 | 4 |
| 2014 | 6 | 5 |
| 2015 | 7 | 18 |
| 2016 | 5 | 9 |
| 2017 | 12 | 10 |
| 2018 | 10 | 7 |
| 2019 | 6 | 13 |
| 2020 | 7 | 12 |
| 2021 | 10 | 6 |
| 2022 | 8 | 7 |
| 2023 | 5 | 3 |
| 2024 | 5 | 7 |
| 2025 | 5 | 4 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Fabricating functional circuits on 3D freeform surfaces via intense pulsed light-induced zinc mass transfer17 Feb 2026US 12,557,223 B2The Penn State Research Foundation
- Conductive slurry, waterproof pressing structure, circuit membrane and fabrication method thereof16 Dec 2025US 12,501,556 B2Life-On Technology Corporation
- Methods for producing an etch resist pattern on a metallic surface8 Apr 2025US 12,270,111 B2Kateeva, Inc.
- Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatus18 Mar 2025US 12,256,491 B2Sony Group Corporation
- Electronic components for soft, flexible circuitry layers and methods therefor18 Feb 2025US 12,230,579 B2LOOMIA Technologies, Inc.
- Controlling fluid flows using hydrophobic surfaces6 Aug 2026US 2026/0231362 A1Dell Products L. P.
- Electronic assembly, soldering board, and oxygen-free copper layer26 Feb 2026US 2026/0059659 A1Tong Hsing Electronic Industries, Ltd.
- Component carrier, method for manufacturing a component carrier and a package comprising a component carrier2 Oct 2025US 2025/0309013 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Droplet actuator fabrication apparatus, systems, and related methods24 Jul 2025US 2025/0235864 A1Abbott Laboratories
- Methods for producing an etch resist pattern on a metallic surface19 Jun 2025US 2025/0198008 A1Kateeva, Inc.
Most cited
By later US patents
- Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same58US 6,911,400 B2International Business Machines Corporation · 2005
- Method for forming conductive film pattern, and electro-optical device and electronic apparatus48US 6,734,029 B2Seiko Epson Corporation · 2004
- Method of forming film pattern, device for forming film pattern, conductive film wiring, electro-optical device, electronic device, and non-contact card medium47US 6,715,871 B2Seiko Epson Corporation · 2004
- Conductive electrical element and antenna with ink additive technology31US 6,701,605 B2Sonoco Development, Inc. · 2004
- Electroless plating-resisting ink composition30US 5,158,989 ASomar Corporation · 1992