Methods for producing an etch resist pattern on a metallic surface
AssigneeKateeva, Inc.
InventorsNava Shpaisman, Moshe Frenkel
Life of this patent
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Abstract
A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.
Claims20
A method of forming a metallic pattern, the method comprising:
- chemically activating an object comprising copper by exposing the object to a solution containing a compound selected from the group consisting of a copper salt, a ferric salt, a chromic-sulfuric acid, a persulfate salt, sodium chlorite, and hydrogen peroxide, to form copper ions;
- after chemically activating the object, printing onto the activated object, in a pattern, a liquid containing an anionic polymeric component;
- reacting the anionic component with the copper ions to form an etch mask on the activated object, the etch mask defining covered and uncovered portions of the object;
- and
- performing an etching process to remove uncovered portions of the activated object to form the metallic pattern.
A method of forming a metallic pattern, the method comprising:
- chemically activating an object comprising copper by exposing the object to a solution containing a compound selected from the group consisting of a copper salt, a ferric salt, a chromic-sulfuric acid, a persulfate salt, sodium chlorite, and hydrogen peroxide;
- after chemically activating the object, printing onto the activated object, in a pattern, a liquid containing a reactive component that is an acrylic component, phosphate component, sulfonate component, or any combination thereof;
- reacting the reactive component with the chemically activated object to form an etch mask defining covered and uncovered portions of the activated object;
- and
- performing an etching process to remove portions of the activated object that are not covered by the etch mask to form the metallic pattern.
A method of forming a metallic pattern, the method comprising:
- chemically activating an object comprising copper by exposing the object to a solution containing a compound selected from the group consisting of a copper salt, a ferric salt, a chromic-sulfuric acid, a persulfate salt, sodium chlorite, and hydrogen peroxide, to form copper ions;
- after chemically activating the object, printing onto the activated object, in a pattern, a liquid containing a water soluble anionic polymeric component;
- reacting the anionic component with the copper ions to form an etch mask on the activated object, the etch mask defining covered and uncovered portions of the activated object;
- and
- performing an etching process to remove uncovered portions of the activated object to form the metallic pattern.
Dependencies are inferred from the claim text.