Component carrier, method for manufacturing a component carrier and a package comprising a component carrier

A method for manufacturing a component carrier, the method comprising:

• a) forming a stack, said stack comprising:
• at least one electrically conductive layer structure, and
• a solder resist layer structure;
• wherein said at least one electrically conductive layer structure and said solder resist layer structure are arranged, in particular stacked, in a stacking direction (Z);
• wherein said solder resist layer structure comprises at least one opening by which a portion of the at least one electrically conductive layer structure is exposed,
• b) providing at least on a part of said exposed portion of the at least one electrically conductive layer structure at least one protective layer structure;
• wherein said protective layer structure being provided comprises an at least substantially plate-shaped central portion having a first thickness distribution (dcp=f (X, Y)), and an at least substantially wall-shaped peripheral portion having a second thickness distribution (dpp=f (hw, X, Y)),
• wherein said protective layer structure is being provided such that:
• said central portion is provided at least partially in contact with the exposed portion;
• and
• said peripheral portion is provided at least partially at an external side of the central portion and being at least partially extending in a direction (hw, hw1, hw2) different from a plate extension direction (X, Y) of the central portion;
• and
• wherein the first thickness distribution (dcp=f (X, Y)) is different from the second thickness distribution (dpp=f (hw, X, Y)).