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US 5,158,989 AGranted
Electroless plating-resisting ink composition
AssigneeSomar Corporation
InventorsOsamu Ogitani, Toru Shirose
Life of this patent
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Abstract
A photocurable ink composition for forming patterns resistive to electroless plating is disclosed which includes (a) an epoxy resin, (b) an aliphatic polyol polyglycidyl ether as a reactive, viscosity controlling agent, (c) a photopolymerization catalyst, and (d) hydrophobic silica particles as a thixotropic agent.
Claims9
A photocurable ink composition consisting essentially of the following ingredients (a) through (d):
- (a) an epoxy resin having at least two glycidyl ether groups each bonded directly to an aromatic nucleus;
- (b) an aliphatic polyol polyglycidyl ether;
- (c) a photopolymerization catalyst;
- and
- (d) hydrophobic silica particles, wherein the weight ratio of ingredient (a) to ingredient (b) is in the range of 90:10 to 40:60 and the amounts of ingredients 10 (c) and (d) are 0.1-10 % and 0.5-15 %, respectively, based on the total weight of ingredients (a) and (b).
2 more elements
Dependencies are inferred from the claim text.