Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatus
AssigneeSony Group Corporation
InventorsKoji Aoyama, Naoto Sasaki
Life of this patent
Estimating the term…
Abstract
An electronic component mounted body includes a substrate, a connection section provided on the substrate, an electronic component having a terminal connected to the connection section, and a solder that fixes the electronic component to the connection section. The connection section has a first region in which the terminal is fixed through the solder, and a second region lower in wettability than the first region, and the second region has an extension region extended to a peripheral edge of the connection section, and a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge.
Claims20
An electronic component mounted body, comprising:
- a substrate;
- a connection section provided on the substrate;
- an electronic component having a terminal connected to the connection section;
- and
- a solder that fixes the electronic component to the connection section,
- wherein the connection section comprises:
- a first region in which the terminal is fixed by the solder;
- and
- a second region lower in wettability than the first region,
- wherein the second region comprises:
- an extension region extended to a peripheral edge of the connection section;
- and
- a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge,
- wherein a surface of the substrate is provided with a laser processed region adjacent to the extension region, and
- wherein a width of the laser processed region is equal to a width of the extension region.
An electronic component mounting substrate, comprising:
- a substrate;
- and
- a connection section provided on the substrate,
- wherein the connection section comprises:
- a first region;
- and
- a second region lower in wettability than the first region,
- wherein the second region comprises:
- an extension region extended to a peripheral edge of the connection section;
- and
- a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge,
- wherein a surface of the substrate is provided with a laser processed region adjacent to the extension region, and
- wherein a width of the laser processed region is equal to a width of the extension region.
A method of manufacturing an electronic component mounted body, the method comprising:
- removing part of a first metallic layer by laser processing to expose a second metallic layer lower in wettability than the first metallic layer, thereby forming, on a substrate, a connection section that has a first region in which the first metallic layer is exposed and a second region in which the second metallic layer is exposed,
- wherein the second region comprises:
- an extension region extended to a peripheral edge of the connection section;
- and
- a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge,
- wherein a surface of the substrate is provided with a laser processed region adjacent to the extension region, and
- wherein a width of the laser processed region is equal to a width of the extension region.
Dependencies are inferred from the claim text.