H05K 2203/111
Preheating
Official title: Preheating, e.g. before soldering
H05K2203/111 (Preheating) appears on 99 US grants and 81 published applications in this corpus.
Search patents in H05K- Granted patents
- 99
- Published applications
- 81
- Assignees
- 86
- Inventors
- 216
- Latest grant
- 26 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 5 |
| 2003 | 5 | 5 |
| 2004 | 5 | 11 |
| 2005 | 2 | 4 |
| 2006 | 3 | 3 |
| 2007 | 5 | 5 |
| 2008 | 2 | 6 |
| 2009 | 2 | 0 |
| 2010 | 2 | 4 |
| 2011 | 0 | 2 |
| 2012 | 2 | 1 |
| 2013 | 1 | 1 |
| 2014 | 1 | 3 |
| 2015 | 5 | 7 |
| 2016 | 3 | 1 |
| 2017 | 2 | 1 |
| 2018 | 6 | 1 |
| 2019 | 1 | 2 |
| 2020 | 5 | 3 |
| 2021 | 2 | 3 |
| 2022 | 0 | 2 |
| 2023 | 3 | 2 |
| 2024 | 3 | 2 |
| 2025 | 5 | 5 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Direct resin embedding26 Aug 2025US 12,402,258 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- System and method for controlling flow of solder in a wave soldering machine15 Jul 2025US 12,363,833 B2Illinois Tool Works Inc.
- System and method for controlling flow of solder in a wave soldering machine8 Jul 2025US 12,356,555 B2Illinois Tool Works Inc.
- Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole1 Jul 2025US 12,349,287 B2Pac Tech—Packaging Technologies GmbH
- Embedded component package structure and manufacturing method thereof1 Apr 2025US 12,267,961 B2Advanced Semiconductor Engineering, Inc.
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Dispensing heater and methods of use9 Apr 2026US 2026/0101446 A1Nano Dimension Technologies, Ltd.
- Printed circuit board and electronic device comprising same13 Nov 2025US 2025/0351263 A1Samsung Electronics Co., Ltd.
- Method and system for connecting a terminal element to a substrate28 Aug 2025US 2025/0275063 A1Infineon Technologies AG
- Embedded component package structure and manufacturing method thereof10 Jul 2025US 2025/0227849 A1Advanced Semiconductor Engineering, Inc.
Most cited
By later US patents
- Method and process of contract to a heat softened solder ball array67US 6,329,637 B1Micron Technology, Inc. · 2001
- Method of soldering in a controlled-convection surface-mount reflow furnace47US 5,232,145 AWatkins-Johnson Company · 1993
- Method and process of contact to a heat softened solder ball array46US 6,967,307 B2Micron Technology, Inc. · 2005
- Method and arrangement for reflow soldering and reflow unsoldering of circuit boards37US 4,832,249 ALicentia Patent-Verwaltungs-G.m.b.H. · 1989
- Method and process of contact to a heat softened solder ball array34US 6,121,576 AMicron Technology, Inc. · 2000