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US 12,402,258 B2Granted
Direct resin embedding
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsEwald Moitzi, Friedrich Beller, Thomas Kristl
Life of this patent
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Abstract
A method of manufacturing a component carrier includes providing a core structure with at least one electrically insulating layer structure with a through hole, closing the through hole by a resin layer, and attaching a component in the through hole to the resin layer. The component is fixed to the core structure by curing the resin layer.
Claims13
A method of manufacturing a component carrier, the method comprising:
- providing a core structure comprising at least one electrically insulating layer structure and having a through hole;
- closing the through hole by a resin layer;
- attaching a component in the through hole to the resin layer;
- and
- fixing the component to the core structure by curing the resin layer;
- attaching a further resin layer to a top surface of the component and of the core structure, and
- simultaneously curing the resin layer and the further resin layer for forming a resin shell, so that the resin layer and the further resin layer flow inside the through hole and merge together inside the through hole.
4 more elements
A component carrier, comprising:
- a core structure comprising at least one electrically insulating layer structure;
- a component embedded in a through hole of the core structure;
- a resin layer closing the through hole, wherein a portion of the component is embedded in the resin layer, such that a resin shell is formed by the resin layer for at least partially homogeneously surrounding, as only dielectric material, at least the portion of the component;
- wherein the resin layer is integrally formed with at least one patterned or continuous resin layer on a bottom main surface and/or on a top main surface of the core structure;
- wherein the resin layer formed at the bottom main surface and the resin layer formed on the top mains surface of the core structure are partially arranged inside the through hole and are merged together inisde the through hole.
2 more elements
Dependencies are inferred from the claim text.