Method and process of contract to a heat softened solder ball array
AssigneeMicron Technology, Inc.
InventorsDavid R. Hembree, Warren M. Farnworth
Life of this patent
Estimating the term…
Abstract
A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.
Claims59
A method for making contact between an array of solid conductive solder bumps on a semiconductor device a plurality of conductive contact sites on a surface of a first member, comprising:
- heating at least one solder bump of said array of solid conductive solder bumps to a softening temperature Ts below a melting temperature of said at least one solder bump of said array of solid conductive solder bumps;
- and
- contacting at least one conductive contact site of said plurality of conductive contact sites by said at least one solder bump of said array of solid conductive solder bumps of said semiconductor device using a pressure less than substantially 22 grams-force for the at least one solder bump and another solder bump said array of solid conductive solder bumps.
A method to temporarily engage at least one conductive solder bump of an array of conductive solder bumps on a semiconductor device with at least one conductive contact side of a plurality of conductive contact sites on a surface of a first member, comprising:
- heating said at least one conductive solder bump of said array of conductive solder bumps to a softening temperature Ts below a melting temperature of said at least one conductive solder bump of said array of conductive solder bumps;
- and
- compressing said at least one conductive solder bump of said array of conductive solder bumps on said semiconductor device to said at least one conductive contact site of said plurality of conductive contact sites at a pressure less than substantially 22 grams-force and another solder bump of said array of conductive solder bumps.
An apparatus who used to temporarily connect at least one solder ball of a ball grid array of solder balls during connection to at least one conductive contact site of a plurality of conductive contact sites, said apparatus comprising:
- a first member with a surface having an array of solder balls thereon;
- a second member with a surface having an array of conductive contact sites;
- apparatus for contacting said first member against said second member for electrical contact of said at least one solder ball of said ball grid array of solder balls to said at least one conductive contact site of said plurality of conductive contact sites, said first member contacting said second member at a pressure less than substantially 22 grams-force for said at least one solder bump and another solder bump of said ball grid array of solder bumps;
- and
- heating apparatus for heating said at least one solder ball of said ball grid array of solder balls and said at least on conductive contact site of said plurality of conductive contact sites to a submelting solder softening temperature Ts.
A testing apparatus used to test a semiconductor package having a ball grid array of solder balls on a surface thereof, said apparatus comprising:
- an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for electrical contact with said ball grid array of solder balls, and having a second surface;
- a substrate having a first surface, having a second surface, said second surface of said insert secured to said first surface of said surface, and having a pattern of conductive leads on said substrate for connection to contact leads in a socket;
- electrical leads connecting said array of conductive contact sites of said insert with said pattern of conductive leads of said substrate;
- a test board having said socket with said contact leads to a testing circuit, said substrate and insert insertable into said socket for contact of said array of conductive leads of said substrate with said contact leads of said socket;
- and
- heating apparatus associated with one of said substrate, said insert and said socket.
The apparatus of calim 35, further comprising a switch apparatus for turning said heating apparatus on and off.
An apparatus used to temporarily connect at least one solder ball of a plurality of solder balls of a solder ball array on a first member to a corresponding contact site of a plurality of contact sites on a second member, said second member connected to a third member, said apparatus comprising:
- a board having a socket thereon for accepting said first member, second memberm, and third member, said board having at least two through-holes extending therethrough;
- an heating conductor mounted on an underside of said third member;
- spring-loaded pogo pins mounted to project a pin portion upwardly through each of said at least two through-holes to contact said third member;
- and
- power leads connecting each pogo pin of said spring-loaded pogo pins to a power supply for heating said first member, second member, and third member including at elast one solder ball of said plurality of solder balls of a solder ball array and at least one corresponding contact site of said plurality of contact sites.
A heating apparatus used to heat at least one solder ball of a ball grid array of solder balls while subjected to a compression force against at least one conductive contact site of a plurality of conductive sites for temporary electrical contact, said apparatus comprising:
- a first member having a surface having an array of solder balls thereon;
- a second member having a surface having an array of conductive contact sites;
- apparatus for compressing said first member against said second member to contact said at least one solder ball of said ball grid array of solder balls with said at least one contact site of said plurality of contact sites, said first member compressed against said second member at a pressure less than substantially 22 grams-force per solder ball;
- and
- heating apparatus for heating said at least one solder ball of said ball grid array of solder balls and said at least one conductive contact site of said plurality of contact sites to a submelting solder softening temperature Ts.
The apparatus of calim 46, wherein each of said plurality of conductive contact sites comprises a flat surface.
The apparatus of calim 46, wherein each of said plurality of conductive contact sites comprises an indentation having at least one projection extending thereinto.
A testing apparatus for a semiconductor assembly having a ball grid array of solder balls on a surface thereof, said apparatus comprising:
- an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for contact with at least one solder ball of said ball grid array of solder balls and having a second surface;
- a substrate having a first surface and a second surface, said second surface of said insert attached to said first surface of said substrate, a pattern of conductive leads on said substrate for connection to contact leads in a socket;
- electrical leads connecting said array of conductive contact sites of said insert with said pattern of conductive leads of said substrate;
- a test board having said socket with said contact leads to a testing circuit, said substrate and insert insertable into said socket for electrical contact of said pattern of conductive leads of said substrate with said contact leads of said socket;
- heating apparatus associated with one of said substrate, said insert and said socket;
- and
- power supply leads providing electrical power to said heating apparatus.
An apparatus used to temporarily connect at least one solder ball of a plurality of solder balls of a solder ball array on a first member to at least one corresponding contact site of a plurality of contact sites on a second member, said second member attached to a third member, said apparatus comprising:
- a board having a socket thereon for accepting said first member, said second member, and said third member, said board having at least two through-holes extending therethrough and having first and second through-hole axes generally perpendicular to said broad;
- at least one heating conductor mounted on an underside of said third member, said at least one heating conductor having junctions positioned intercepting said through-hole axes of said first through-hole and said second through-hole extending through said board;
- a spring-loaded pogo pin moounted to project a pin portion upwardly through each of said at least two through-holes of said board to contact said third member;
- and
- power leads connecting said spring-loaded pogo pin to a power supply for heating said first member, second member, and said third member including said at least one solder ball of said plurality of solder balls of said solder ball array and said at least one corresponding contact site of said plurality of contact sites.
Dependencies are inferred from the claim text.