System and method for controlling flow of solder in a wave soldering machine

A wave soldering machine to perform a wave soldering operation on a printed circuit board, the wave soldering machine comprising:

• a housing;
• a conveyor coupled to the housing, the conveyor being configured to deliver a printed circuit board through the housing;
• and
• a wave soldering station coupled to the housing, the wave soldering station including
• a solder pot having a reservoir of solder material,
• a flow duct positioned in the reservoir of the solder pot,
• a wave soldering nozzle assembly coupled to the flow duct, the wave soldering nozzle assembly having a solder distribution baffle configured to create a solder wave and at least two nozzle plates, each nozzle plate being configured to rotate with respect to the solder distribution baffle between an open position in which solder flows through the solder distribution baffle and the nozzle plate and a closed position in which solder is prohibited from flowing through the solder distribution baffle and the nozzle plate, and
• a core frame supported by the flow duct and configured to support the solder distribution baffle,
• wherein the wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.