Embedded component package structure and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien-Fan Chen, Chien-Hao Wang
Life of this patent
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Abstract
A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.
Claims20
A component package structure, comprising:
- a component having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;
- and
- an encapsulation layer covering the lateral surface of the component and having a third surface, wherein the third surface defines a recessed portion.
A component package structure, comprising:
- a component having a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;
- and
- a first dielectric layer covering the first surface of the component,
- wherein the first dielectric layer defines a first via hole and a second via hole, wherein the first via hole is disposed over the first surface of the component,
- wherein the first via hole and the second via hole are overlapped in a direction substantially parallel to the first surface, and
- wherein a dimension of the second via hole measured in the direction is different from a dimension of the first via hole measured in the direction.
A component package structure, comprising:
- a dielectric layer;
- an electronic component disposed over the dielectric layer, wherein the electronic component has a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface;
- an encapsulation layer covering the lateral surface of the electronic component and a lateral surface of the dielectric layer;
- and
- a via hole horizontally overlapped with the electronic component,
- wherein the via hole extends in the dielectric layer and the encapsulation layer.
Dependencies are inferred from the claim text.