Method and process of contact to a heat softened solder ball array
AssigneeMicron Technology, Inc.
InventorsDavid R. Hembree, Warren M. Farnworth
Life of this patent
Estimating the term…
Abstract
A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.
Claims19
A method for connecting a solder bump of an array of solder bumps on a semiconductor device and a contact site of a plurality of conductive contact sites of a member, comprising:
- heating the solder bump of the array of solder bumps to a softening temperature
- Ts below a melting temperature of the solder bump of the array of solder bumps;
- and
- contacting the contact site of the plurality of conductive contact sites by the solder bump of the array of solder bumps of the semiconductor device using a pressure less than substantially 22 grams-force.
An apparatus for connecting a solder ball to a contact site comprising:
- a first member having a solder ball thereon;
- a second member having a contact site;
- apparatus for moving the first member against the second member for contact of the solder ball to the contact site, the first member contacting the second member at a pressure less than substantially 22 grams-force for the solder ball;
- and
- heating apparatus for heating the solder ball and the contact site to a submelting solder-softening temperature Ts.
A testing apparatus for a semiconductor package having a ball grid array of solder balls on a surface thereof, the apparatus comprising:
- an insert formed of generally noncompliant material, the insert having a first surface including an array of contact sites for contacting the ball grid array of solder balls and having a second surface;
- a substrate having a first surface, having a second surface, the second surface of the insert secured to the first surface of the substrate, and having a pattern of leads on the substrate for connecting to contact leads in a socket;
- electrical leads connecting the array of contact sites of the insert with the pattern of leads of the substrate;
- a test board having the socket with the contact leads connected to a testing circuit, the substrate and the insert for insertion into the socket for contact of the pattern of leads of the substrate with the contact leads of the socket;
- and
- heating apparatus associated with at least one of the substrate, the insert, and the socket.
Dependencies are inferred from the claim text.