Method and process of contact to a heat softened solder ball array
AssigneeMicron Technology, Inc.
InventorsDavid R. Hembree, Warren M. Farnworth
Life of this patent
Estimating the term…
Abstract
A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting "softening" temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus, are disclosed.
Claims59
A method for making temporary contact between an array of conductive solder bumps on a semiconductor device and conductive contact sites on a surface of a first member, comprising:
- heating said solder bumps to a softening temperature T.sub.S below a melting temperature of said solder bumps;
- and
- contacting said conductive contact sites with said solder bumps of said semiconductor device after the heating thereof, said solder bumps contacting said conductive contact sites at a pressure less than substantially 22 grams-force per bump.
A method for temporary engagement of an array of conductive solder bumps on a semiconductor device to conductive contact sites on a surface of a first member, comprising:
- heating said solder bumps to a softening temperature T.sub.S below a melting temperature of said solder bumps;
- and
- compressing said solder bumps on said semiconductor device to said conductive contact sites at a pressure less than substantially 22 grams-force per bump.
An apparatus for heating a ball grid array of solder balls while subjected to a compression force against conductive contact sites for temporary electrical contact, said apparatus comprising:
- a first member with a surface having an array of solder balls thereon;
- a second member with a surface having an array of conductive contact sites;
- apparatus for contacting said first member against said second member for electrical contact of said solder balls with corresponding conductive contact sites said first member contacting said second member at a pressure less than substantially 22 grams-force per bump;
- and
- heating apparatus for heating said solder balls and said corresponding conductive contact sites to a submelting solder softening temperature T.sub.S.
An apparatus for electrically testing a semiconductor package having a ball grid array of solder balls on a surface thereof, said apparatus comprising:
- an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for electrical contact with said ball grid array, and a second surface;
- a substrate having a first surface and a second surface, said second surface of said insert bonded to said first surface of said substrate, a pattern of conductive leads on said substrate for connection to contact leads in a socket;
- electrical leads connecting said conductive contact sites of said insert with said conductive leads of said substrate;
- a test board having said socket with said contact leads to a testing circuit, wherein said substrate and bonded insert are insertable into said socket for electrical contact of said conductive leads of said substrate with said contact leads of said socket;
- and
- heating apparatus associated with one of said substrate, said insert and said socket.
An apparatus for temporarily electrically connecting solder balls of a solder ball array on a first member to corresponding contact sites on a second member, said second member attached to a third member, said apparatus comprising:
- a board having a socket thereon for accepting said first, second, and third members, said board having at least two through-holes extending therethrough;
- an electrical resistance heating conductor mounted on an underside of said third member;
- a spring-loaded pogo pin mounted to project a pin portion upwardly through each of said through-holes to contact said third member;
- and
- power leads connecting said pogo pins electrically to a power supply for heating said first, second and third members including said solder balls and corresponding contact sites.
An apparatus for heating a ball grid array of solder balls while subjected to a compression force against conductive contact sites for temporary electrical contact, said apparatus comprising:
- a first member with a surface having an array of solder balls thereon;
- a second member with a surface having an array of conductive contact sites;
- apparatus for compressing said first member against said second member for electrical contact of said solder balls with corresponding conductive contact sites, said first member compressed against said second member at a pressure less than substantially 22 grams-force per ball;
- and
- heating apparatus for heating said solder balls and said corresponding conductive contact sites to a submelting solder softening temperature T.sub.S.
An apparatus for electrically testing a semiconductor package having a ball grid array of solder balls on a surface thereof, said apparatus comprising:
- an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for electrical contact with said ball grid array, and a second surface;
- a substrate having a first surface and a second surface, said second surface of said insert bonded to said first surface of said substrate, a pattern of conductive leads on said substrate for connection to contact leads in a socket;
- electrical leads connecting said conductive contact sites of said insert with said conductive leads of said substrate;
- a test board having said socket with said contact leads to a testing circuit, wherein said substrate and bonded insert are insertable into said socket for electrical contact of said conductive leads of said substrate with said contact leads of said socket;
- heating apparatus associated with one of said substrate, said insert and said socket;
- and
- power supply leads providing electrical power to said heating apparatus.
An apparatus for temporarily electrically connecting solder balls of a solder ball array on a first member to corresponding contact sites on a second member, said second member attached to a third member, said apparatus comprising:
- a board having a socket thereon for accepting said first, second, and third members, said board having at least two through-holes extending therethrough and having first and second through-hole axes generally perpendicular to said board;
- an electrical resistance heating conductor mounted on an underside of said third member, said conductor having junctions positioned to intercept said first and second through-hole axes;
- a spring-loaded pogo pin mounted to project a pin portion upwardly through each of said through-holes to contact said third member;
- and
- power leads connecting said pogo pins electrically to a power supply for heating said first, second and third members including said solder balls and corresponding contact sites.
Dependencies are inferred from the claim text.