H05K 2203/1163
Chemical reaction
Official title: Chemical reaction, e.g. heating solder by exothermic reaction
H05K2203/1163 (Chemical reaction) appears on 86 US grants and 110 published applications in this corpus.
Search patents in H05K- Granted patents
- 86
- Published applications
- 110
- Assignees
- 77
- Inventors
- 236
- Latest grant
- 26 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 3 |
| 2002 | 1 | 1 |
| 2003 | 2 | 3 |
| 2004 | 4 | 15 |
| 2005 | 6 | 10 |
| 2006 | 4 | 5 |
| 2007 | 3 | 7 |
| 2008 | 4 | 13 |
| 2009 | 1 | 12 |
| 2010 | 4 | 2 |
| 2011 | 7 | 7 |
| 2012 | 7 | 2 |
| 2013 | 6 | 2 |
| 2014 | 4 | 4 |
| 2015 | 2 | 5 |
| 2016 | 2 | 1 |
| 2017 | 1 | 3 |
| 2018 | 2 | 5 |
| 2019 | 6 | 3 |
| 2020 | 1 | 0 |
| 2021 | 1 | 2 |
| 2022 | 3 | 1 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
| 2025 | 0 | 4 |
By publication year. Applications have been published since 2001.
Recent patents
- Self-sintering conductive inks26 Nov 2024US 12,152,156 B2Science Applications International Corporation
- Flexible circuit electrode array and method of manufacturing the same11 Apr 2023US 11,627,664 B2Cortigent, Inc.
- Methods of etching conductive features, and related devices and systems23 Aug 2022US 11,425,822 B2Kateeva, Inc.
- Method of preparing graphene circuit pattern28 Jun 2022US 11,372,300 B2Boe Technology Group Co., Ltd.
- Printing of nanowire films1 Feb 2022US 11,240,917 B2Technology Innovation Momentum Fund (Israel) Limited Partnership
- Foldable substrates, foldable articles, and methods of making the same14 Aug 2025US 2025/0258521 A1Corning Incorporated
- Heat dissipation substrate, heat dissipation circuit board, heat dissipation member, and method for manufacturing heat dissipation substrate5 Jun 2025US 2025/0185151 A1Kochi Prefectural Public University Corporation
- Conductive articles and methods for additive manufacturing thereof22 May 2025US 2025/0163278 A1PPG Industries Ohio, Inc.
- Method for manufacturing circuit board20 Feb 2025US 2025/0063671 A1Lx Semicon Co., Ltd.
- Self-Sintering Conductive Inks29 Sep 2022US 2022/0306887 A1Science Applications International Corporation
Most cited
By later US patents
- Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips132US 5,001,542 AHitachi Chemical Company, Ltd. · 1991
- Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits120US 5,120,665 AHitachi Chemical Company, Ltd. · 1992
- Method of making reactive multilayer foil and resulting product95US 6,534,194 B2The Johns Hopkins University · 2003
- Flexible circuit electrode array and method of manufacturing the same83US 7,877,866 B1Second Sight Medical Products, Inc. · 2011
- Process for connecting circuits and adhesive film used therefor66US 5,843,251 AHitachi Chemical Company, Ltd. · 1998