Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
AssigneeHitachi Chemical Company, Ltd.
InventorsIsao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto
Life of this patent
Estimating the term…
Abstract
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
Claims12
A process for connecting circuits, which comprises
- placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, and
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B),
- the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B),
- conducting electric current passing test for both circuits while pressing in an uncured state of the composition, and
- curing the composition under pressure to obtain electrical connection.
A process for connecting circuits, which comprises
- placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film,
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and
- (D) rigid particles having an average particles size smaller than that of the coated particles (B),
- the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B),
- conducting electric current passing test for both circuits while pressing in an uncured state of the composition, and
- curing the composition under pressure to obtain electrical connection.
A process for connecting circuits, which comprises
- placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, and
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B),
- the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B),
- conducting electric current passing test for both circuits while pressing, and
- curing the composition under pressure to obtain electrical connection.
A process for connecting circuits, which comprises
- placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film,
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and
- (D) the rigid particles having an average particle size smaller than that of the coated particles (B),
- the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B),
- conducting electric current passing test for both circuits while pressing, and
- curing the composition under pressure to obtain electrical connection.
Dependencies are inferred from the claim text.