H05K 2203/1105
Heating or thermal processing not related to soldering, firing, curing or laminating
Official title: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
H05K2203/1105 (Heating or thermal processing not related to soldering, firing, curing or laminating) appears on 711 US grants and 670 published applications in this corpus.
Search patents in H05K- Granted patents
- 711
- Published applications
- 670
- Assignees
- 442
- Inventors
- 1,987
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 6 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 9 | 0 |
| 1986 | 5 | 0 |
| 1987 | 7 | 0 |
| 1988 | 11 | 0 |
| 1989 | 16 | 0 |
| 1990 | 8 | 0 |
| 1991 | 10 | 0 |
| 1992 | 9 | 0 |
| 1993 | 14 | 0 |
| 1994 | 17 | 0 |
| 1995 | 19 | 0 |
| 1996 | 15 | 0 |
| 1997 | 15 | 0 |
| 1998 | 19 | 0 |
| 1999 | 17 | 0 |
| 2000 | 17 | 0 |
| 2001 | 25 | 11 |
| 2002 | 20 | 19 |
| 2003 | 20 | 22 |
| 2004 | 17 | 26 |
| 2005 | 13 | 36 |
| 2006 | 13 | 29 |
| 2007 | 20 | 35 |
| 2008 | 5 | 60 |
| 2009 | 16 | 48 |
| 2010 | 26 | 41 |
| 2011 | 23 | 20 |
| 2012 | 28 | 14 |
| 2013 | 18 | 10 |
| 2014 | 16 | 19 |
| 2015 | 8 | 31 |
| 2016 | 20 | 20 |
| 2017 | 17 | 26 |
| 2018 | 10 | 22 |
| 2019 | 22 | 22 |
| 2020 | 30 | 32 |
| 2021 | 23 | 36 |
| 2022 | 30 | 19 |
| 2023 | 10 | 23 |
| 2024 | 20 | 19 |
| 2025 | 15 | 16 |
| 2026 | 10 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laser folded 3D electronics29 Sep 2026US 12,750,950 B2The United States of America as represented by the Secretary of the Army
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Wiring board and manufacturing method therefor28 Jul 2026US 12,696,385 B2Toppan Holdings Inc.
- Method, apparatus and system for processing a composite waste source26 May 2026US 12,637,737 B2NewSouth Innovations Pty Limited
- Method for manufacturing substrate with built-in components, and substrate with built-in components26 May 2026US 12,641,728 B2Resonac Corporation
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Multilayer substrate, method of manufacturing multilayer substrate, and electronic device10 Sep 2026US 2026/0271178 A1Murata Manufacturing Co., Ltd.
- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
- Method for manufacturing circuit board, apparatus for packaging circuit board, and electronic apparatus27 Aug 2026US 2026/0255497 A1Samsung Display Co., Ltd.
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
Most cited
By later US patents
- Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom286US 6,036,099 A2000
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- Photoreactive surface processing160US 5,669,979 AUVTech Systems, Inc. · 1997
- Multilayer printed circuit154US 5,716,663 AToranaga Technologies, Inc. · 1998
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996