Deposition apparatus, method for depositing, method for packaging a die in a chip package

A deposition method for depositing materials on a target, the method comprising:

• providing a deposition schedule that specifies a pattern of deposition positions where specimen of the materials are to be deposited on the target;
• providing a donor plate having a first main surface coated with the materials,
• controllably displacing the target and the donor plate relative to each other while a target surface of the target faces the first main surface of the donor plate at a gap distance thereof;
• controlling, while controllably displacing, the heater facility for each specimen to be deposited in accordance with the deposition schedule to eject the specimen from an ejection position of the donor plate at a point in time that a spatial vector defined between the deposition position specified for the specimen and the ejection position corresponds to the lateral movement occurring in a time interval wherein the ejected specimen traverses the gap distance,
• wherein according to a first option the donor plate is provided with a plurality of mutually distinct material species in donor plate zone,
• wherein the plurality of mutually distinct material species is ejected simultaneously by heating the donor plate zone the method comprising a donor plate preparation step,
• wherein the positions and/or shapes of each of the mutually distinct material species on the donor plate are computed based on the pattern of deposition positions and/or shapes with which the mutually distinct material species are to be deposited on the target surface of the target and on a respective expected transfer velocity of the ejected species which is predicted in accordance with size and/or shape and/or material properties of the mutually distinct material species, or wherein according to a second option the deposition schedule comprises a target pattern with two or more target pattern elements to be formed by depositing one or more of the materials on the target surface,
• wherein the method comprises:
• providing a donor plate having at its first main surface a patterned region with a donor pattern of donor pattern elements each corresponding to a respective one of the target pattern elements and comprising the material of the corresponding target pattern element to be formed;
• and
• while moving the donor plate and the target relative to each other integrally heating the patterned region of the donor plate to simultaneously eject donor pattern elements to the target surface to form the respective target pattern elements of the target;
• wherein providing the donor plate comprises determining respective positions of the donor pattern elements in the donor pattern in accordance with the respective positions of the target pattern elements in the target pattern to be formed and the respective expected time of transfer of each donor pattern element to the target surface dependent on the material of which the donor pattern element is composed and size of the donor pattern element.