Method for manufacturing substrate with built-in components, and substrate with built-in components

A method for manufacturing a substrate with built-in components, the method comprising:

• providing an intermediate member including an electronic component with a first electrode provided on a first surface thereof, and a first electrically conductive layer provided on the first surface of the electronic component so as to cover the first electrode;
• and
• forming a first insulating resin layer on a first surface of the intermediate member,
• wherein the first electrically conductive layer includes a first curable adhesive layer formed from a curable adhesive layer including electrically conductive particles and a cured adhesive composition, and a first metal foil layer disposed on the first curable adhesive layer that is a surface on a side opposite to the electronic component, and
• wherein the electrically conductive particles of the first curable adhesive layer electrically connect the first electrode of the electronic component and the first metal foil layer,
• wherein the providing of the intermediate member includes:
• preparing the electronic component;
• preparing a first adhesive film;
• bonding the first adhesive film to the first surface of the electronic component so as to cover the first electrode;
• and
• heating and pressure-bonding the first adhesive film to the electronic component,
• wherein the first adhesive film includes a first adhesive layer formed from an adhesive layer which includes electrically conductive particles and an adhesive composition and in which the electrically conductive particles are dispersed in the adhesive composition, and the first metal foil layer disposed on the first adhesive layer that is a surface on a side opposite to the electronic component, and
• wherein in the heating and pressure-bonding, the first adhesive film is heated and pressure-bonded to cause the electrically conductive particles of the first adhesive film to electrically connect the first electrode of the electronic component to the first metal foil layer, and the adhesive layer of the first adhesive film is cured to obtain the first curable adhesive layer,
• wherein surface roughness Rz of a surface of at least one metal foil layer of the first metal foil layer and the second metal foil layer on a side attached to the corresponding adhesive layer is 20 μm or less.

A substrate with built-in components, comprising:

• an intermediate member including an electronic component with a first electrode provided on a first surface thereof, and a first electrically conductive layer provided on the first surface of the electronic component so as to cover the first electrode;
• and
• a first insulating resin layer formed on a first surface of the intermediate member,
• wherein the first electrically conductive layer includes a first curable adhesive layer formed from a curable adhesive layer including electrically conductive particles and a cured adhesive composition, and a first metal foil layer disposed on the first curable adhesive layer that is a surface on a side opposite to the electronic component,
• wherein the electrically conductive particles of the first curable adhesive layer electrically connect the first electrode of the electronic component and the first metal foil layer, and
• wherein a ratio of surface roughness Rz of a surface of the first metal foil layer on the first curable adhesive layer side with respect to an average particle diameter of the electrically conductive particles is 0.05 to 3.