Method for manufacturing circuit board, apparatus for packaging circuit board, and electronic apparatus
AssigneeSamsung Display Co., Ltd.
InventorsWONTAE KIM, JAE-HAN LEE
Life of this patent
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Abstract
A method for manufacturing a circuit board includes preparing a base layer on which a pad area is defined, placing a first metal layer on a top surface of the base layer, placing a bump overlapping the pad area, on a top surface of the first metal layer, when viewed in a thickness direction of the base layer, placing a driving chip on a top surface of the bump, placing a reel on a bottom surface of the base layer, rotating the reel in a first rotation direction to wind the base layer, the first metal layer, the bump, and the driving chip to be disposed inside the reel, and applying heat to the reel to package the reel.
Claims18
A method for manufacturing a circuit board, the method comprising:
- preparing a base layer on which a pad area is defined;
- placing a first metal layer on a top surface of the base layer;
- placing a bump overlapping the pad area, on a top surface of the first metal layer, when viewed in a thickness direction of the base layer;
- placing a driving chip on a top surface of the bump;
- placing a reel on a bottom surface of the base layer;
- rotating the reel in a first rotation direction to wind the base layer, the first metal layer, the bump, and the driving chip to be disposed inside the reel;
- and
- applying heat to the reel to package the reel.
An apparatus for packaging a circuit board, the apparatus comprising:
- a reel which rotates in a first rotation direction and a second rotation direction opposite to the first rotation direction;
- and
- a circuit board disposed inside the reel,
- wherein the circuit board comprises:
- a base layer on which a pad area is defined;
- a first metal layer disposed on a top surface of the base layer;
- a bump overlapping the pad area, disposed on a top surface of the first metal layer, when viewed in a thickness direction of the base layer;
- and
- a driving chip disposed on a top surface of the bump,
- wherein the reel is disposed on a bottom surface of the base layer.
An electronic apparatus comprising:
- a display device which displays an image;
- and
- a processor which processes an image signal and provides the processed image signal to the display device,
- wherein the display device comprises a circuit board manufactured by:
- preparing a base layer on which a pad area is defined;
- placing a first metal layer on a top surface of the base layer;
- placing a bump overlapping the pad area, on a top surface of the first metal layer, when viewed in a thickness direction of the base layer;
- placing a driving chip on a top surface of the bump;
- placing a reel on a bottom surface of the base layer;
- rotating the reel in a first rotation direction to wind the base layer;
- applying heat to the reel;
- rotating the reel in a second rotation direction opposite to the first rotation direction to unwind the base layer;
- and
- rotating the reel in the first rotation direction to place the base layer, the first metal layer, the bumps, and the driving chip inside the reel to perform the packaging.
Dependencies are inferred from the claim text.