G03F 7/004
Photosensitive materials
Official title: Photosensitive materials (G03F7/12, G03F7/14 take precedence)
G03F7/004 (Photosensitive materials) appears on 18,411 US grants and 16,888 published applications in this corpus.
Search patents in G03F- Granted patents
- 18,411
- Published applications
- 16,888
- Assignees
- 2,394
- Inventors
- 22,083
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 128 | 0 |
| 1977 | 119 | 0 |
| 1978 | 105 | 0 |
| 1979 | 105 | 0 |
| 1980 | 135 | 0 |
| 1981 | 251 | 0 |
| 1982 | 151 | 0 |
| 1983 | 153 | 0 |
| 1984 | 160 | 0 |
| 1985 | 200 | 0 |
| 1986 | 202 | 0 |
| 1987 | 197 | 0 |
| 1988 | 182 | 0 |
| 1989 | 287 | 0 |
| 1990 | 303 | 0 |
| 1991 | 339 | 0 |
| 1992 | 261 | 0 |
| 1993 | 338 | 0 |
| 1994 | 377 | 0 |
| 1995 | 292 | 0 |
| 1996 | 301 | 0 |
| 1997 | 361 | 0 |
| 1998 | 426 | 0 |
| 1999 | 430 | 0 |
| 2000 | 503 | 0 |
| 2001 | 463 | 159 |
| 2002 | 414 | 535 |
| 2003 | 425 | 651 |
| 2004 | 501 | 641 |
| 2005 | 366 | 646 |
| 2006 | 416 | 651 |
| 2007 | 388 | 630 |
| 2008 | 359 | 641 |
| 2009 | 387 | 684 |
| 2010 | 450 | 717 |
| 2011 | 425 | 607 |
| 2012 | 509 | 667 |
| 2013 | 544 | 636 |
| 2014 | 711 | 642 |
| 2015 | 684 | 683 |
| 2016 | 616 | 686 |
| 2017 | 523 | 633 |
| 2018 | 452 | 617 |
| 2019 | 537 | 680 |
| 2020 | 454 | 715 |
| 2021 | 402 | 650 |
| 2022 | 412 | 704 |
| 2023 | 463 | 789 |
| 2024 | 424 | 794 |
| 2025 | 456 | 818 |
| 2026 | 324 | 612 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G03F 7/09Characterised by structural details5,383
- G03F 7/039Macromolecular compounds which are photodegradable4,936
- G03F 7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds4,662
- G03F 7/038Macromolecular compounds which are rendered insoluble or differentially wettable4,233
- G03F 7/0045With organic non-macromolecular light-sensitive compounds not otherwise provided for3,917
- G03F 7/075Silicon-containing compounds2,138
- G03F 7/0046With perfluoro compounds1,898
- G03F 7/022Quinonediazides1,434
All 18 subgroupsShow fewer
- G03F 7/0042With inorganic or organometallic light-sensitive compounds not otherwise provided for719
- G03F 7/0047Characterised by additives for obtaining a metallic or ceramic pattern517
- G03F 7/0048Characterised by the solvents or agents facilitating spreading466
- G03F 7/016Diazonium salts or compounds351
- G03F 7/06Silver salts312
- G03F 7/008Azides196
- G03F 7/085Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives169
- G03F 7/025Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds107
- G03F 7/0041Providing an etching agent upon exposure66
- G03F 7/04Chromates50
Recent patents
- Color-resist compositions and display panels6 Oct 2026US 12,754,476 B2Huizhou China Star Optoelectronics Display Co., Ltd.
- Photosensitive composition for forming light blocking layer of organic light emitting device6 Oct 2026US 12,754,477 B2Duk San Neolux Co., Ltd.
- Photohardenable compositions and methods of forming an object6 Oct 2026US 12,754,478 B2Quadratic 3D, Inc.
- EUV resist underlayer film-forming composition6 Oct 2026US 12,754,479 B2Nissan Chemical Corporation
- Hardmask composition, hardmask layer, and pattern forming method6 Oct 2026US 12,754,481 B2Samsung SDI.Co., Ltd.
- Gas-based development of organometallic resist in an oxidizing halogen-donating environment8 Oct 2026US 2026/0310073 A1Inpria Corporation
- Resist composition and patterning process8 Oct 2026US 2026/0310074 A1Shin-Etsu Chemical Co., Ltd.
- Onium salt monomer, polymer, chemically amplified resist composition, and pattern forming process8 Oct 2026US 2026/0310075 A1Shin-Etsu Chemical Co., Ltd.
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound8 Oct 2026US 2026/0310076 A1FUJIFILM Corporation
- Resist composition, resist pattern formation method, compound, and polymer compound8 Oct 2026US 2026/0310077 A1Tokyo Ohka Kogyo.Co., Ltd.
Most cited
By later US patents
- Arrays of materials attached to a substrate1,410US 5,744,305 AAffymetrix, Inc. · 1998
- Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone645US 4,491,628 AInternational Business Machines Corporation · 1985
- Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides552US 4,857,382 AGeneral Electric Company · 1989
- Polymer and a forming method of a micro pattern using the same493US 6,225,020 B1Hyundai Electronics Industries Co., Ltd. · 2001
- Substrate processing method and substrate processing apparatus490US 6,620,251 B2Tokyo Electron Limited · 2003