G03F 7/038
Macromolecular compounds which are rendered insoluble or differentially wettable
Official title: Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021)
G03F7/038 (Macromolecular compounds which are rendered insoluble or differentially wettable) appears on 4,233 US grants and 4,801 published applications in this corpus.
Search patents in G03F- Granted patents
- 4,233
- Published applications
- 4,801
- Assignees
- 980
- Inventors
- 7,610
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 21 | 0 |
| 1977 | 22 | 0 |
| 1978 | 28 | 0 |
| 1979 | 20 | 0 |
| 1980 | 28 | 0 |
| 1981 | 39 | 0 |
| 1982 | 33 | 0 |
| 1983 | 26 | 0 |
| 1984 | 26 | 0 |
| 1985 | 34 | 0 |
| 1986 | 32 | 0 |
| 1987 | 35 | 0 |
| 1988 | 18 | 0 |
| 1989 | 37 | 0 |
| 1990 | 29 | 0 |
| 1991 | 39 | 0 |
| 1992 | 29 | 0 |
| 1993 | 43 | 0 |
| 1994 | 59 | 0 |
| 1995 | 38 | 0 |
| 1996 | 51 | 0 |
| 1997 | 56 | 0 |
| 1998 | 65 | 0 |
| 1999 | 71 | 0 |
| 2000 | 109 | 0 |
| 2001 | 98 | 29 |
| 2002 | 89 | 109 |
| 2003 | 79 | 164 |
| 2004 | 124 | 169 |
| 2005 | 81 | 163 |
| 2006 | 101 | 136 |
| 2007 | 87 | 129 |
| 2008 | 75 | 121 |
| 2009 | 73 | 143 |
| 2010 | 84 | 131 |
| 2011 | 87 | 112 |
| 2012 | 95 | 146 |
| 2013 | 101 | 138 |
| 2014 | 159 | 217 |
| 2015 | 181 | 281 |
| 2016 | 225 | 244 |
| 2017 | 176 | 252 |
| 2018 | 169 | 245 |
| 2019 | 188 | 243 |
| 2020 | 182 | 257 |
| 2021 | 143 | 236 |
| 2022 | 141 | 237 |
| 2023 | 158 | 247 |
| 2024 | 120 | 240 |
| 2025 | 135 | 226 |
| 2026 | 94 | 186 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G03F 7/0382The macromolecular compound being present in a chemically amplified negative photoresist composition1,091
- G03F 7/0388With ethylenic or acetylenic bands in the side chains of the photopolymer899
- G03F 7/0387Polyamides or polyimides389
- G03F 7/0385Using epoxidised novolak resin125
- G03F 7/0384With ethylenic or acetylenic bands in the main chain of the photopolymer93
- G03F 7/0381Using a combination of a phenolic resin and a polyoxyethylene resin13
Recent patents
- Photohardenable compositions and methods of forming an object6 Oct 2026US 12,754,478 B2Quadratic 3D, Inc.
- Hybrid method of forming microstructure array molds, methods of making microstructure arrays, and methods of use15 Sep 2026US 12,734,730 B2Panther Life Sciences Corporation
- Polymer and method for producing same, and resin composition for resist15 Sep 2026US 12,735,519 B2Maruzen Petrochemical Co., Ltd.
- Resist composition and method for forming resist pattern15 Sep 2026US 12,736,875 B2Tokyo Ohka Kogyo.Co., Ltd.
- Compound, binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same15 Sep 2026US 12,736,876 B2LG Chem.Ltd.
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound8 Oct 2026US 2026/0310076 A1FUJIFILM Corporation
- Resist composition, resist pattern formation method, compound, and polymer compound8 Oct 2026US 2026/0310077 A1Tokyo Ohka Kogyo.Co., Ltd.
- Negative resist composition and method for producing resist pattern8 Oct 2026US 2026/0310078 A1Sumitomo Chemical Company, Limited
- Resist composition and resist pattern formation method1 Oct 2026US 2026/0299410 A1Tokyo Ohka Kogyo.Co., Ltd.
- Negative photosensitive resin composition, negative photosensitive resin composition coating, negative photosensitive resin composition film, cured layer, and semiconductor device using these1 Oct 2026US 2026/0299418 A1Toray Industries, Inc.
Most cited
By later US patents
- Photoresist cross-linker and photoresist composition comprising the same474US 6,368,773 B1Hyundai Electronics Industries Co., Ltd. · 2002
- Water-soluble negative photoresist polymer and composition containing the same469US 7,399,570 B2Hynix Semiconductor Inc. · 2008
- Lithography patterning with a gas phase resist422US 10,018,920 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Polyurethane resins having multiple mechanisms of hardening for use in producing three-dimensional objects271US 9,453,142 B2Carbon3D, Inc. · 2016
- Free-form fabricaton using multi-photon excitation185US 6,316,153 B1University of Connecticut · 2001