G03F 7/0387
Polyamides or polyimides
Official title: {Polyamides or polyimides}
G03F7/0387 (Polyamides or polyimides) appears on 389 US grants and 328 published applications in this corpus.
Search patents in G03F- Granted patents
- 389
- Published applications
- 328
- Assignees
- 142
- Inventors
- 841
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 9 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 10 | 0 |
| 1987 | 12 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 9 | 0 |
| 1991 | 5 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 10 | 0 |
| 1995 | 12 | 0 |
| 1996 | 11 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 10 | 0 |
| 2000 | 15 | 0 |
| 2001 | 12 | 1 |
| 2002 | 7 | 13 |
| 2003 | 7 | 8 |
| 2004 | 9 | 9 |
| 2005 | 5 | 5 |
| 2006 | 5 | 5 |
| 2007 | 2 | 9 |
| 2008 | 4 | 5 |
| 2009 | 6 | 8 |
| 2010 | 7 | 12 |
| 2011 | 7 | 8 |
| 2012 | 4 | 7 |
| 2013 | 5 | 4 |
| 2014 | 10 | 9 |
| 2015 | 4 | 10 |
| 2016 | 7 | 13 |
| 2017 | 9 | 9 |
| 2018 | 10 | 29 |
| 2019 | 16 | 25 |
| 2020 | 21 | 18 |
| 2021 | 9 | 20 |
| 2022 | 12 | 22 |
| 2023 | 10 | 17 |
| 2024 | 13 | 16 |
| 2025 | 15 | 27 |
| 2026 | 5 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Underlayer compound for photolithography, multilayered structure formed using the same, and method for manufacturing semiconductor devices using the same1 Sep 2026US 12,724,346 B2Inha University Research and Business Foundation
- Photosensitive polyimide compositions9 Jun 2026US 12,650,646 B2Promerus, LLC
- Photosensitive resin composition and method for producing cured relief pattern28 Apr 2026US 12,613,465 B2Asahi Kasei Kabushiki Kaisha
- Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component24 Mar 2026US 12,583,973 B2Shin-Etsu Chemical Co., Ltd.
- Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device10 Feb 2026US 12,545,784 B2Toray Industries, Inc.
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound8 Oct 2026US 2026/0310076 A1FUJIFILM Corporation
- Negative photosensitive resin composition, negative photosensitive resin composition coating, negative photosensitive resin composition film, cured layer, and semiconductor device using these1 Oct 2026US 2026/0299418 A1Toray Industries, Inc.
- Photosensitive resin composition, resin film having pattern, method for producing resin film having pattern, and semiconductor circuit board24 Sep 2026US 2026/0292972 A1Jsr Corporation
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device27 Aug 2026US 2026/0251975 A9FUJIFILM Corporation
- Negative photosensitive resin composition, dry film, cured product, and electronic component13 Aug 2026US 2026/0235951 A1Taiyo Holdings Co., Ltd.
Most cited
By later US patents
- Hydroxy polyimides and high temperature positive photoresists therefrom123US 4,927,736 AHoechst Celanese Corporation · 1990
- Method for the preparation of relief structures96US 3,957,512 ASiemens Aktiengesellschaft · 1976
- Polyimides, a process for their preparation and their use90US 4,629,777 ACiba-Geigy Corporation · 1986
- Organic solvent-soluble photosensitive polyamide resin70US 4,595,745 AUbe Industries, Ltd. · 1986
- Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell66US 4,741,988 AU. S. Philips Corporation · 1988