Hydroxy polyimides and high temperature positive photoresists therefrom

Abstract

This invention relates to novel hydroxy polyimides and radiation sensitive compositions prepared therefrom. More particularly the invention relates to positive photoresists useful in the preparation of a thermally stable relief pattern on a substrate e.g. a silicon wafer or aluminum plate. The novel hydroxy polyimides of the invention may also be used to provide thermally stable organic protective films and layers e.g. an insulating and/or a passivating layer in a semi-conductor component. The novel hydroxy polyimides of in this invention can be synthesized by the condensation of a hydroxy-substituted aminophenol and a dianhydride. Radiation sensitive compositions prepared from the novel hydroxy polyimides of the invention can be developed in aqueous base developer or organic solvent developer; preferably aqueous base developer. Also, the base developer dissolution properties of the polyimides can be controlled by incorporating a non-hydroxyl diamine into the polyimide. The polyimides utilized in this invention have good solubility properties in various organic solvents and also have good mechanical, electrical, adhesion and thermal properties. Radiation sensitive compositions made from hydroxy polyimides of this invention provide high-resolution relief images which are thermally stable up to a temperature of approximately 300.degree. C.

Dependencies are inferred from the claim text.