Back to results
US 12,545,784 B2Granted
Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device
AssigneeToray Industries, Inc.
InventorsKazuyuki Matsumura, Yoshiko Tateoka, Akira Shimada
Life of this patent
Estimating the term…
Abstract
In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, in which (A) the polymer compound has a carboxylic acid residue at a molecular chain terminal.
Claims11
A resin composition consisting essentially of:
- (A) a polymer compound a having a structure in which a molecular chain terminal is derived from a carboxylic acid residue and having a structure derived from a compound represented by at least one of the following formulae (3) and (4):
- wherein R1, R2, and R3 each independently represent a hydrogen atom or a methyl group,
- (B) a cationic polymerizable compound comprising an epoxy, oxetane or vinyl ether compound, and
- (C) a cationic polymerization initiator comprising a sulfonium salt, wherein
- (A) the polymer compound is 30 to 70% by mass, and (B) the cationic polymerizable compound is 30 to 70% by mass, based on a resin total of 100% by mass,
- (C) the cationic polymerization initiator is 0.3 to 10 parts by mass based on 100 parts by mass of (B) the cationic polymerizable compound and
- the resin composition is curable by a cationic polymerization reaction.
4 more elements
Dependencies are inferred from the claim text.