Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell
AssigneeU.S. Philips Corporation
InventorsJohan M. Van der Zande, Lourens Minnema
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Abstract
A method of manufacturing a polyimide pattern which is provided with a metal layer, such that a dual layer system is exposed in accordance with a certain pattern, which pattern contains a photosensitive polyamide acid derivative and a positive photoresist which is developed, provided with a metal layer and removed, after which, the polyamide acid derivative layer is developed and imidisied, as well as a new photosensitive polyamide acid derivative and an electrophoretic image-display cell.
Claims7
A method of forming a patterned polyimide film on a substrate, which patterned polyimide film is provided with an electrically conductive layer at its surface facing away from the substrate, said method comprising:
- (a) providing said substrate with a layer of a negative-acting photosensitive polyamide acid derivative which is obtained by reacting polyamide acid with at least one compound of the formula 1 ##STR12## in which R.sub.1 and R.sub.2 both independently represent a lower alkyl group of 1-4 carbon atoms or a hydrogen atom,
- R is an alkylene group of 1-5 carbon atoms,
- X is an oxygen atom or the group --N(R.sub.3)--, in which R.sub.3 is a hydrogen atom or a lower alkyl group of 1-4 carbon atoms, and m has the value 0 or 1, on the condition that in at least one compound that is used the value of m is 1;
- (b) applying a layer of a photosensitive photoresist on said layer of photosensitive polyamide derivative;
- (c) exposing the resultant assembly patternwise;
- (d) developing the resultant patternwise exposed photoresist layer to remove the exposed portions of said photoresist layer;
- (e) applying to the remaining portions of said photoresist layer and to the exposed portions of said layer of the polyamide derivative an electrically conductive layer;
- (f) removing, by means of a lift-off process, the remaining portions of said photoresist layer and the overlying portions of said electrically conductive layer;
- and
- (g) subjecting portions of said polyamide derivative remaining on said substrate to a heat treatment and imidization to form a polyimide.
Dependencies are inferred from the claim text.