Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, semiconductor device, polyimide, manufacturing method for polyimide, and compound

A photosensitive resin composition comprising:

• a polyimide from which a structure having 2 or more carbon atoms is eliminated upon heating at 230° C. for 3 hours;
• and
• a photosensitizer.

A polyimide comprising:

• a repeating unit represented by Formula (1-1),
• in Formula (1-1), X1 represents an organic group having 4 or more carbon atoms, Y1 represents an organic group having 4 or more carbon atoms, R1's each independently represent a structure represented by Formula (R-1), n and m each represent an integer of 0 to 4, and n+m represents an integer of 1 or more,
• in Formula (R-1), L1 represents an acetal group, L2 represents a single bond or a divalent linking group, Z1 represents a (1+a1)-valent linking group, A1 represents a polymerizable group, a1 represents an integer of 0 or more and a maximum substituent number of Z1 or less, and * represents a bonding site to X1 or Y1 in Formula (1-1).

A compound represented by Formula (A-1),

• in Formula (A-1), Z1's each independently represent a (1+a1)-valent linking group, A1's each independently represent a polymerizable group, a1's each independently represent an integer of 1 or more and a maximum substituent number of Z1 or less, RB1 and RB2 each independently represent a hydrogen atom or a monovalent organic group, and a2 represents 2.

A compound represented by Formula (B-1),

• in Formula (B-1), Z1 represents a (1+a1)-valent linking group, A1 represents a polymerizable group, a1 represents an integer of 1 or more and a maximum substituent number of Z1 or less, RB1 and RB2 each independently represent a hydrogen atom or a monovalent organic group, and Hal represents a halogen atom.