Photosensitive resin composition and method for producing cured relief pattern

A negative-type photosensitive resin composition comprising:

• (A) a polyimide precursor at 100 parts by mass;
• and
• (B) a photopolymerization initiator at 0.1 part by mass to 20 parts by mass;
• wherein
• the polyimide precursor (A) comprises a polyamic acid ester or polyamic acid salt represented by the following formula (1) at 60 mass % or more with respect to the total polyimide precursor (A):
• wherein:
• X1 is a tetravalent organic group of 6 to 40 carbon atoms;
• Y2 is a divalent organic group of 6 to 40 carbon atoms which is at least one divalent organic group selected from among groups represented by
• the following formula (7):
• wherein R9-R12 are each a hydrogen atom or a monovalent aliphatic group of 1 to 4 carbon atoms, which may be different from each other or the same,
• the following formula (8):
• or
• the following formula (9):
• wherein R13-R14 are each methyl group;
• n is an integer of 2 to 50;
• and
• R1 and R2 each independently represent a hydrogen atom, a group represented by the following formula (2):
• wherein R3, R4 and R5 are each independently a hydrogen atom or a monovalent organic group of 1 to 3 carbon atoms, and in is an integer of 2 to 10), or
• a group represented by the following formula (3):
• wherein R6, R7 and R8 are each independently a hydrogen atom or an organic group of 1 to 3 carbon atoms, and m2 is an integer of 2 to 10),
• with the proviso that R1 and R2 are not both hydrogen, and
• the weight-average molecular weight (Mw) of the polyimide precursor (A) is 3,000 or greater and less than 16,000 in terms of polystyrene, according to gel permeation chromatography (GPC).