G03F 7/0382
The macromolecular compound being present in a chemically amplified negative photoresist composition
Official title: {the macromolecular compound being present in a chemically amplified negative photoresist composition}
G03F7/0382 (The macromolecular compound being present in a chemically amplified negative photoresist composition) appears on 1,091 US grants and 1,574 published applications in this corpus.
Search patents in G03F- Granted patents
- 1,091
- Published applications
- 1,574
- Assignees
- 233
- Inventors
- 1,867
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 9 | 9 |
| 2002 | 26 | 37 |
| 2003 | 26 | 63 |
| 2004 | 37 | 63 |
| 2005 | 37 | 61 |
| 2006 | 47 | 58 |
| 2007 | 39 | 37 |
| 2008 | 31 | 45 |
| 2009 | 30 | 52 |
| 2010 | 34 | 47 |
| 2011 | 38 | 50 |
| 2012 | 34 | 63 |
| 2013 | 49 | 65 |
| 2014 | 66 | 54 |
| 2015 | 68 | 52 |
| 2016 | 67 | 77 |
| 2017 | 52 | 59 |
| 2018 | 54 | 55 |
| 2019 | 42 | 54 |
| 2020 | 38 | 61 |
| 2021 | 31 | 90 |
| 2022 | 47 | 79 |
| 2023 | 65 | 83 |
| 2024 | 39 | 76 |
| 2025 | 49 | 105 |
| 2026 | 27 | 79 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Resist composition and method for forming resist pattern15 Sep 2026US 12,736,875 B2Tokyo Ohka Kogyo.Co., Ltd.
- Compound, binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same15 Sep 2026US 12,736,876 B2LG Chem.Ltd.
- Polymer crosslink de-crosslink processes for resist patterning15 Sep 2026US 12,736,882 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Photoactive compounds, photoresist compositions including the same, and pattern formation methods25 Aug 2026US 12,717,231 B2Dupont Electronic Materials International, LLC
- Resist composition, resist pattern formation method, compound, and polymer compound8 Oct 2026US 2026/0310077 A1Tokyo Ohka Kogyo.Co., Ltd.
- Negative resist composition and method for producing resist pattern8 Oct 2026US 2026/0310078 A1Sumitomo Chemical Company, Limited
- Resist composition and resist pattern formation method1 Oct 2026US 2026/0299410 A1Tokyo Ohka Kogyo.Co., Ltd.
- Resist composition, resist pattern formation method, compound and polymer compound1 Oct 2026US 2026/0299419 A1Tokyo Ohka Kogyo.Co., Ltd.
- Salt, acid generator, resin, resist composition, and method for producing resist pattern24 Sep 2026US 2026/0288002 A1Sumitomo Chemical Company, Limited
Most cited
By later US patents
- Photoresist cross-linker and photoresist composition comprising the same474US 6,368,773 B1Hyundai Electronics Industries Co., Ltd. · 2002
- Water-soluble negative photoresist polymer and composition containing the same469US 7,399,570 B2Hynix Semiconductor Inc. · 2008
- Method and photoresist with zipper mechanism130US 8,323,870 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2012
- Surface switchable photoresist93US 8,715,919 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Resin useful for resist, resist composition and pattern forming process using the same85US 6,303,266 B1Kabushiki Kaisha Toshiba · 2001