G03F 7/085
Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
Official title: Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives (G03F7/075 takes precedence)
G03F7/085 (Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives) appears on 169 US grants and 181 published applications in this corpus.
Search patents in G03F- Granted patents
- 169
- Published applications
- 181
- Assignees
- 127
- Inventors
- 581
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 3 |
| 2002 | 2 | 1 |
| 2003 | 1 | 4 |
| 2004 | 4 | 7 |
| 2005 | 0 | 7 |
| 2006 | 6 | 7 |
| 2007 | 5 | 6 |
| 2008 | 3 | 5 |
| 2009 | 4 | 5 |
| 2010 | 1 | 5 |
| 2011 | 1 | 6 |
| 2012 | 5 | 4 |
| 2013 | 5 | 9 |
| 2014 | 10 | 6 |
| 2015 | 5 | 8 |
| 2016 | 8 | 8 |
| 2017 | 6 | 5 |
| 2018 | 6 | 2 |
| 2019 | 2 | 10 |
| 2020 | 2 | 12 |
| 2021 | 10 | 19 |
| 2022 | 10 | 14 |
| 2023 | 5 | 17 |
| 2024 | 7 | 4 |
| 2025 | 8 | 6 |
| 2026 | 6 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Casting lacquer for screen printing25 Aug 2026US 12,716,002 B2BASF SE
- Photosensitive resin composition, transfer film, cured film, laminate, and method for manufacturing touch panel25 Aug 2026US 12,717,230 B2FUJIFILM Corporation
- Method for producing display device, and display device21 Jul 2026US 12,690,378 B2Sharp Kabushiki Kaisha
- Positive resist composition and pattern forming process17 Feb 2026US 12,554,197 B2Shin-Etsu Chemical Co., Ltd.
- Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element10 Feb 2026US 12,547,074 B2Resonac Corporation
- Photoresist compositions and methods of manufacturing semiconductor devices using the same23 Apr 2026US 2026/0110961 A1Samsung Electronics Co., Ltd.
- Bottom antireflective coating materials20 Nov 2025US 2025/0355358 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Casting lacquer for screen printing21 Aug 2025US 2025/0263566 A1BASF SE
- Compositions and methods of improving metal structure fabrication by wet chemical etch31 Jul 2025US 2025/0244669 A1Merck Patent GmbH
- Chemically amplified positive photoresist composition for improving pattern profile and enhancing adhesion19 Jun 2025US 2025/0199406 A1Ycchem Co., Ltd.
Most cited
By later US patents
- Substrate processing method and substrate processing apparatus490US 6,620,251 B2Tokyo Electron Limited · 2003
- Method of making a negative photoresist image71US 4,104,070 AInternational Business Machines Corporation · 1978
- Avoid photoresist lifting by post-oxide-dep plasma treatment35US 5,807,660 ATaiwan Semiconductor Manufacturing Company.Ltd · 1998
- Promoting adhesion of fluoropolymer films to semiconductor substrates29US 6,699,798 B2Intel Corporation · 2004
- Method of making a lithographic printing plate28US 8,232,043 B2Agfa Graphics NV · 2012