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US 12,547,074 B2Granted
Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element
AssigneeResonac Corporation
InventorsYu Aoki, Yoshimi Hamano, Teruaki Suzuki, Masahiro Hashimoto
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Abstract
The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cured film, and a semiconductor element.
Claims11
A photosensitive resin composition comprising:
- (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group;
- and (B) a compound that generates acid by light,
- wherein the alkali-soluble resin (A) is a resin having:
- a bisphenolimide skeleton derived from at least one selected from the group consisting of a compound represented by the following Formula (I), a compound represented by the following Formula (II), and a compound represented by the following Formula (III):
- wherein R1, R2, R3, R4, R5, and R6 each independently represent a hydrogen atom or a methyl group;
- and Ra and Rb each independently represent an ether bond, a thioether bond, a carbonyl group, an alkylene group having 1 to 3 carbon atoms, or a single bond, and
- a structural unit derived from bis(methoxymethyl) biphenyl or dimethoxymethylbenzene.
4 more elements
Dependencies are inferred from the claim text.