Chemically amplified positive photoresist composition for improving pattern profile and enhancing adhesion
AssigneeYcchem Co., Ltd.
InventorsYoung Cheol CHOI, Su Jin LEE, Seung Hun LEE, Seung Hyun LEE
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Abstract
Proposed is a chemically amplified positive photoresist composition for improving a pattern profile and enhancing adhesion, the photoresist composition being exposable by a light source having a wavelength of 248 nm and including, with respect to the total weight of the composition, 1 to 5 wt % of a polyhydric alcohol additive represented by Chemical Formulas 1 to 8 in order to implement a vertical profile without pattern collapse.
Claims5
A chemically amplified positive photoresist composition for improving a pattern profile and enhancing adhesion, the photoresist composition being exposable by a light source having a wavelength of 248 nm and comprising 1 to 5 wt % of a polyhydric alcohol additive represented by 5 Chemical Formulas 1 to 8 below to implement a vertical profile without pattern collapse.
Dependencies are inferred from the claim text.