G03F 7/027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds
Official title: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence)
G03F7/027 (Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds) appears on 4,662 US grants and 4,175 published applications in this corpus.
Search patents in G03F- Granted patents
- 4,662
- Published applications
- 4,175
- Assignees
- 977
- Inventors
- 8,078
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 42 | 0 |
| 1977 | 59 | 0 |
| 1978 | 29 | 0 |
| 1979 | 51 | 0 |
| 1980 | 52 | 0 |
| 1981 | 105 | 0 |
| 1982 | 47 | 0 |
| 1983 | 48 | 0 |
| 1984 | 54 | 0 |
| 1985 | 61 | 0 |
| 1986 | 51 | 0 |
| 1987 | 61 | 0 |
| 1988 | 64 | 0 |
| 1989 | 93 | 0 |
| 1990 | 143 | 0 |
| 1991 | 141 | 0 |
| 1992 | 81 | 0 |
| 1993 | 98 | 0 |
| 1994 | 81 | 0 |
| 1995 | 84 | 0 |
| 1996 | 80 | 0 |
| 1997 | 81 | 0 |
| 1998 | 112 | 0 |
| 1999 | 107 | 0 |
| 2000 | 120 | 0 |
| 2001 | 83 | 19 |
| 2002 | 61 | 89 |
| 2003 | 65 | 120 |
| 2004 | 87 | 128 |
| 2005 | 53 | 136 |
| 2006 | 81 | 125 |
| 2007 | 85 | 157 |
| 2008 | 62 | 144 |
| 2009 | 68 | 144 |
| 2010 | 83 | 182 |
| 2011 | 70 | 141 |
| 2012 | 116 | 140 |
| 2013 | 117 | 158 |
| 2014 | 174 | 178 |
| 2015 | 149 | 178 |
| 2016 | 142 | 174 |
| 2017 | 122 | 164 |
| 2018 | 96 | 209 |
| 2019 | 148 | 183 |
| 2020 | 143 | 236 |
| 2021 | 123 | 191 |
| 2022 | 121 | 223 |
| 2023 | 137 | 220 |
| 2024 | 125 | 221 |
| 2025 | 129 | 179 |
| 2026 | 77 | 136 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Color-resist compositions and display panels6 Oct 2026US 12,754,476 B2Huizhou China Star Optoelectronics Display Co., Ltd.
- Photosensitive composition for forming light blocking layer of organic light emitting device6 Oct 2026US 12,754,477 B2Duk San Neolux Co., Ltd.
- Photosensitive resin composition, cured film, electronic component, antenna element, semiconductor package, and compound29 Sep 2026US 12,747,202 B2Toray Industries, Inc.
- Photosensitive resin composition and display device including the same29 Sep 2026US 12,748,349 B2Samsung Display Co., Ltd.
- Compound, binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same15 Sep 2026US 12,736,876 B2LG Chem.Ltd.
- Photosensitive resin composition, cured product, and semiconductor element1 Oct 2026US 2026/0299412 A1
- Photoresist film1 Oct 2026US 2026/0299413 A1Dupont Electronics, Inc.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board1 Oct 2026US 2026/0299414 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board1 Oct 2026US 2026/0299415 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
Most cited
By later US patents
- Process for the sensitization of an oxidation/reduction photocatalyst, and photocatalyst thus obtained420US 4,684,537 AR. E. Stiftung · 1987
- Ternary photoinitiator system for addition polymerization289US 5,545,676 AMinnesota Mining and Manufacturing Company · 1996
- Oxime ester photoiniators having a combined structure283US 7,189,489 B2Ciba Specialty Chemicals Corporation · 2007
- Polyurethane resins having multiple mechanisms of hardening for use in producing three-dimensional objects271US 9,453,142 B2Carbon3D, Inc. · 2016
- Oxime ester photoinitiators263US 7,759,043 B2Ciba Specialty Chemicals Corporation · 2010