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US 2026/0299415 A1Published application
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
AssigneeResonac Corporation
InventorsNatsuki TODA, Taku SAWAKI, Kensuke YOSHIHARA, Yosuke KAGUCHI
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Abstract
A photosensitive resin composition according to an aspect of the present disclosure contains: a binder polymer; a photopolymerizable compound; and a photopolymerization initiator, and the binder polymer has a structural unit derived from acrylic acid and a structural unit derived from methacrylic acid.
Claims10
A photosensitive resin composition comprising:
- a binder polymer;
- a photopolymerizable compound;
- and a photopolymerization initiator,
- wherein the binder polymer has a structural unit derived from acrylic acid and a structural unit derived from methacrylic acid.
1 more element
Dependencies are inferred from the claim text.