H05K 2203/04
Soldering or other types of metallurgic bonding
H05K2203/04 (Soldering or other types of metallurgic bonding) appears on 3,155 US grants and 2,743 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,155
- Published applications
- 2,743
- Assignees
- 1,083
- Inventors
- 6,425
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 2 | 0 |
| 1978 | 7 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 6 | 0 |
| 1982 | 13 | 0 |
| 1983 | 16 | 0 |
| 1984 | 13 | 0 |
| 1985 | 14 | 0 |
| 1986 | 18 | 0 |
| 1987 | 24 | 0 |
| 1988 | 24 | 0 |
| 1989 | 41 | 0 |
| 1990 | 17 | 0 |
| 1991 | 25 | 0 |
| 1992 | 44 | 0 |
| 1993 | 47 | 0 |
| 1994 | 50 | 0 |
| 1995 | 57 | 0 |
| 1996 | 60 | 0 |
| 1997 | 66 | 0 |
| 1998 | 96 | 0 |
| 1999 | 90 | 0 |
| 2000 | 114 | 0 |
| 2001 | 130 | 52 |
| 2002 | 129 | 113 |
| 2003 | 112 | 117 |
| 2004 | 97 | 123 |
| 2005 | 89 | 157 |
| 2006 | 91 | 155 |
| 2007 | 95 | 172 |
| 2008 | 78 | 175 |
| 2009 | 91 | 186 |
| 2010 | 125 | 139 |
| 2011 | 120 | 103 |
| 2012 | 106 | 85 |
| 2013 | 77 | 72 |
| 2014 | 73 | 99 |
| 2015 | 74 | 148 |
| 2016 | 95 | 108 |
| 2017 | 103 | 93 |
| 2018 | 94 | 84 |
| 2019 | 89 | 73 |
| 2020 | 86 | 91 |
| 2021 | 63 | 87 |
| 2022 | 70 | 88 |
| 2023 | 58 | 73 |
| 2024 | 65 | 75 |
| 2025 | 48 | 40 |
| 2026 | 37 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2203/041Solder preforms in the shape of solder ballsIndexing code789
- H05K 2203/049Wire bondingIndexing code637
- H05K 2203/043Reflowing of solder coated conductors, not during connection of componentsIndexing code630
- H05K 2203/0415Small preforms other than ballsIndexing code260
- H05K 2203/0425Solder powder or solder coated metal powderIndexing code194
- H05K 2203/0465Shape of solderIndexing code175
- H05K 2203/044Solder dip coating, i.e. coating printed conductorsIndexing code163
- H05K 2203/0455Pth for surface mount device [smd]Indexing code159
All 19 subgroupsShow fewer
- H05K 2203/048Self-alignment during solderingIndexing code150
- H05K 2203/0485Tacky fluxIndexing code84
- H05K 2203/0405Solder foil, tape or wireIndexing code79
- H05K 2203/046Means for drawing solderIndexing code66
- H05K 2203/047Soldering with different soldersIndexing code61
- H05K 2203/0435Metal coated solderIndexing code40
- H05K 2203/045Solder-filled plated through-hole [pth] during processing wherein the solder is removed fromIndexing code31
- H05K 2203/0475Molten solder just before placing the componentIndexing code28
- H05K 2203/042Remote solder depot on the pcb, the solder flowing to the connectionsIndexing code27
- H05K 2203/0445Removing excess solder on padsIndexing code24
- H05K 2203/0495Cold weldingIndexing code13
Recent patents
- Circuit board assembly and method of manufacturing the same, packaging structure having the same1 Sep 2026US 12,727,091 B2Avary Holding (Shenzhen) Co., Limited.
- Optical module11 Aug 2026US 12,706,429 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board assembly, manufacturing method, and electronic device28 Jul 2026US 12,696,393 B2Honor Device Co., Ltd.
- Wave soldering device, manufacturing method thereof and printed circuit board14 Jul 2026US 12,684,701 B2Suzhou Metabrain Intelligent Technology Co., Ltd.
- Adhesive and method for manufacturing circuit connection structure8 Oct 2026US 2026/0313803 A1
- Method for manufacturing embedded trace substrate8 Oct 2026US 2026/0313809 A1Nissha Co., Ltd.
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Electronic device and method of manufacturing the same24 Sep 2026US 2026/0292977 A1Advanced Semiconductor Engineering, Inc.
- Ball grid array package24 Sep 2026US 2026/0292989 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996