H05K 2203/0405
Solder foil, tape or wire
H05K2203/0405 (Solder foil, tape or wire) appears on 79 US grants and 64 published applications in this corpus.
Search patents in H05K- Granted patents
- 79
- Published applications
- 64
- Assignees
- 65
- Inventors
- 247
- Latest grant
- 3 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 4 |
| 2002 | 3 | 2 |
| 2003 | 2 | 1 |
| 2004 | 2 | 7 |
| 2005 | 2 | 3 |
| 2006 | 2 | 2 |
| 2007 | 1 | 2 |
| 2008 | 1 | 4 |
| 2009 | 2 | 8 |
| 2010 | 1 | 1 |
| 2011 | 2 | 5 |
| 2012 | 2 | 3 |
| 2013 | 1 | 1 |
| 2014 | 4 | 6 |
| 2015 | 2 | 3 |
| 2016 | 0 | 3 |
| 2017 | 4 | 1 |
| 2018 | 1 | 1 |
| 2019 | 2 | 0 |
| 2020 | 1 | 1 |
| 2021 | 2 | 3 |
| 2022 | 1 | 2 |
| 2023 | 2 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of manufacturing electronic devices and corresponding electronic device3 Jun 2025US 12,322,684 B2Stmicroelectronics Pte Ltd
- Sleeve soldering device and method of producing electronic device4 Jul 2023US 11,696,411 B2Denso Corporation
- Stretchable mounting board16 May 2023US 11,653,445 B2Murata Manufacturing Co., Ltd.
- PCB structure and electronic device including the same25 Oct 2022US 11,483,935 B2Samsung Electronics Co., Ltd.
- Stretchable mounting board28 Dec 2021US 11,212,915 B2Murata Manufacturing Co., Ltd.
- Surface-treated copper foil and circuit board comprising same14 Mar 2024US 2024/0090137 A1Skc Co., Ltd.
- Method of manufacturing electronic devices and corresponding electronic device3 Nov 2022US 2022/0352057 A1Stmicroelectronics Pte Ltd
- Stretchable mounting board10 Mar 2022US 2022/0078904 A1Murata Manufacturing Co., Ltd.
- Pcb structure and electronic device including the same12 Aug 2021US 2021/0251083 A1Samsung Electronics Co., Ltd.
- Method for producing a sandwhich arrangement18 Feb 2021US 2021/0051803 A1Heraeus Deutschland GmbH & Co. KG
Most cited
By later US patents
- Method of making reactive multilayer foil and resulting product95US 6,534,194 B2The Johns Hopkins University · 2003
- Cast solder leads for leadless semiconductor circuits74US 4,412,642 AWestern Electric Company, Inc. · 1983
- Patterned array of metal balls and methods of making69US 6,000,603 A3M Innovative Properties Company · 1999
- Electronic circuit device and method of producing the same60US 4,673,772 AHitachi, Ltd. · 1987
- Freestanding reactive multilayer foils60US 6,736,942 B2The Johns Hopkins University · 2004