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US 2024/0090137 A1Published application
Surface-treated copper foil and circuit board comprising same
AssigneeSkc Co., Ltd.
InventorsIl Hwan YOO, Joo Young JUNG, Myung Ok KYUN, Ji Yeon RYU, Seung Bae OH
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Abstract
A surface-treated copper foil according to exemplary embodiments includes a copper foil layer and a protrusion layer formed on one surface of the copper foil layer. Pores are formed inside the protrusion layer or around a boundary between the copper foil layer and the protrusion layer. Abnormal growth of the protrusions may be prevented through the pores and thus a bonding force with the insulation layer may be improved.
Claims10
A surface-treated copper foil comprising:
- a copper foil layer;
- and
- a protrusion layer formed on one surface of the copper foil layer,
- wherein the surface-treated copper foil comprises pores formed inside the protrusion layer or around a boundary between the copper foil layer and the protrusion layer.
1 more element
A circuit board comprising:
- an insulation layer;
- and
- a wiring layer formed on a surface of the insulation layer, the wiring layer including a copper foil layer and a protrusion layer formed on one surface of the copper foil layer,
- wherein the wiring layer includes pores formed inside the protrusion layer or around a boundary between the copper foil layer and the protrusion layer.
1 more element
Dependencies are inferred from the claim text.