PCB structure and electronic device including the same

An electronic device comprising:

• a housing;
• and
• a printed circuit board (PCB) structure disposed in the housing,
• wherein the PCB structure includes:
• a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface of the circuit board and a conductive pattern formed in a peripheral area around the opening area, the conductive pattern including a first portion and a second portion;
• a plate disposed on the second surface of the circuit board and covering the opening area;
• an electronic element disposed on the plate and electrically connected with the circuit board;
• a resin portion disposed between the plate and the circuit board, the resin portion extending from the conductive pattern and including a conductive material;
• a solder portion formed between the resin portion and the plate;
• a first insulation layer covering at least part of the conductive pattern and forming at least part of the first surface of the circuit board, wherein the first insulation layer includes a first opening through which the first portion of the conductive pattern is exposed on the first surface of the circuit board;
• and
• a second insulation layer covering at least part of the conductive pattern and forming at least part of the second surface of the circuit board, wherein the second insulation layer includes a second opening through which the second portion of the conductive pattern is exposed on the second surface of the circuit board,
• wherein the second portion of the conductive pattern is electrically connected with the electronic element, the electronic element is electrically connected to the second portion through the plate and the resin portion, and the first portion of the conductive pattern is electrically insulated from the second portion of the conductive pattern, and
• wherein at least part of the resin portion is accommodated in the second opening and between an inside surface of the second opening and a side of the first portion of the conductive pattern facing the inside surface of the second opening, and another part of the resin portion extends along a surface of the second insulation layer to be formed on the second surface of the circuit board.