Method for producing a sandwhich arrangement

Abstract

A method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D and a solder located between said contact surfaces A and D, wherein the solder is produced by melting a solder deposit that is arranged between the two components and connected at the contact surface A or D to one of the components, followed by cooling of the molten solder to below its solidification temperature, wherein the solder deposit is produced previously by melting a solder preform that is fixed to the relevant contact surface A or D by means of an applied fixing agent from a fixing agent composition, followed by cooling of the molten solder to below its solidification temperature, and wherein the solder deposit is arranged with its free contact surface facing the corresponding contact surface D or A of the as of yet unconnected component, wherein the fixing agent composition consists of 0 to 97 wt. % (weight %) of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤285° C., 3 to 100 wt. % of at least one M1 material selected from the group consisting of (i) thermoplastic organic polymers that are meltable between 30 and 180° C. and (ii) non-polymeric organic compounds with no acidic groups that are meltable between 30 and 180° C., 0 to 20 wt. % of at least one M2 material selected from the group consisting of (iii) organic polymers that are not meltable between 30 and 180° C. and (iv) non-polymeric organic compounds with no acidic groups that are not meltable between 30 and 180° C. and not having a boiling point or having a boiling point above 285° C., and 0 to 30 wt. % of one or more inorganic solid fillers, and wherein the sum of the surface sections that are provided with the fixing agent, of the contact surfaces A and B or C and D that upon placing the solder preform together form a common overlapping area, in the presence of one or more components (i) in the at least one M1 material is 1500 μm2 to 50 area % of the common overlapping area, while, when only one or more of the components (ii) are present in the at least one M1 material said sum is 1500 μm2 to 100 area % of the common overlapping area.

Dependencies are inferred from the claim text.